Electronics Forum: assisting (Page 52 of 66)

B.I.C. SMT Process Controls

Electronics Forum | Thu Aug 09 12:53:59 EDT 2001 | seand

Hello everyone, First when defining any criteria for process control, one should identify quantiatively that criteria. Then one establishes an effective method for measuring such a criteria. Once you have a test method, your gateway to a solving y

glue measurement

Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand

Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.

PCBoard Marking

Electronics Forum | Wed Sep 05 12:11:03 EDT 2001 | seand

Hello Michael, Laser marking and ink jet marking are now offered by a wide array of suppliers. The was a bit of a boom at APEX last year in the number of suppliers for these systems. Many have tried label placing but have run into a number of conc

Commercial Postings

Electronics Forum | Wed Sep 26 17:13:55 EDT 2001 | kenbliss

It seems to me that this site is most helpful if anyone can supply a solutiion rather than just an idea to solve a persons problem. In many cases a simple piece of equipment or adjustment to a piece of equipment will solve a problem that the person

Board support issues

Electronics Forum | Tue Sep 18 13:09:21 EDT 2001 | jschake

Hey, where's the 0201s? Just kidding. Off the top of my head, I do not recall seeing results of such a test. Nonetheless, I�ll consult with my peers and let you know if we come up with something that could assist you. That said, with a few more d

Bad Buisness

Electronics Forum | Wed Apr 17 12:01:32 EDT 2002 | cyber_wolf

I am Sr. process technician that has been working in the SMT industry for over ten years. I recently had a phone conversation with a major equipment manufacture's service department. The person that I got on the phone in the service department was ve

Voids in SMD reflowed solder joints

Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan

Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids

Where do I Start?

Electronics Forum | Tue Sep 10 09:56:21 EDT 2002 | gregp

I wish I knew where Mr. Fastek worked so I could contact his customer base to tell them his company may not be here in 6 months. I don't know where you get your information but you are reckless with it. These forums should be based on experiences a

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke

Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr

Walkmen In Assembly Area

Electronics Forum | Sat Dec 21 14:07:53 EST 2002 | No man land

cool Music soothens one's emotions. It should be > mild and not loud. No voice. Just > music...Solos. > > We have used this successfully > in our plant. Every hour we have a two minutes > break to give rest to our operators who use > microscope


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