Electronics Forum | Thu Feb 25 14:52:52 EST 2016 | tombstonesmt
How thick are their requirements? A barrier can be made using peelable latex. That would then require manual or automatic dispense of latex to create a dam. Then you should be able to use an automated dispense system with a large orifice and flood
Electronics Forum | Thu Sep 22 13:22:59 EDT 2016 | bobpan
Hello, The machine measures the part using the laser on the head after picking it up. It then passes or fails it by comparing it to the part size and tolerance for the pickup in the laser extents. You can see this in central controller under laser ex
Electronics Forum | Thu Nov 03 14:33:40 EDT 2016 | csm
Dear JummyB We noted that when the machine is initializing, and when all check step pass, we just push ready button and the main relay or contactor must be activated but is not, it looks like one Card in front of the machine where all the drivers ar
Electronics Forum | Tue May 02 16:37:16 EDT 2017 | travishemen
Our customer wanted us to stack two chips but I convinced them to let us place them side by side on the same pads. It had the same effect. They were 0603 size components and the pads were big enough that they still passed IPC for solder quality. I
Electronics Forum | Tue Jul 25 09:30:08 EDT 2017 | cyber_wolf
"We use Mistral 360 with glass top where you can "see" your process while board pass through the oven, you see when the paste dry, you see when the reflow starts, what is the time above liquid etc etc, and can adjust up or down with few degrees in ea
Electronics Forum | Mon Aug 14 03:38:37 EDT 2017 | spoiltforchoice
The pads in the datasheet should suffice. The TDK part really isn't all that big but its reflow profile indicates it is not exactly the most tolerant device with regards to heat. 245C for 5s is not a lot, I would check very carefully that your profil
Electronics Forum | Fri Sep 22 14:10:19 EDT 2017 | slthomas
Just for the sake of passing along the information, the fine grained stencil provided zero improvement over the standard PhD stainless and was not nearly as helpful as the baked-on nano-coating. We probably won't be trying that again unless we go und
Electronics Forum | Tue Feb 06 16:36:51 EST 2018 | dontfeedphils
For anyone looking back on this post, I ended up figuring out something that will work for my process. Jack up the atomization pressure on the guns, lower material flow, quicker-lighter coats, less time between coats, and more coats. Smooth, even f
Electronics Forum | Tue Mar 06 08:03:42 EST 2018 | wolverine55
Thanks Don, I will pass this info on to the Maintenance department at the plant where this machine is located. I did see an exec stored in the machine's host computer while it was there, it was under a UIC filename of BC237A. They have new 3.6 volt
Electronics Forum | Fri Apr 20 03:04:24 EDT 2018 | tsvetan
We usually replace stencil when we start to get problems with the solder paste printing i.e. uneven solder paste deposit etc. Until then it doesn't matter how many years ago it's manufactured, but how many prints it passes and if the operators didn't
.gif)
