Electronics Forum | Mon Oct 14 17:23:36 EDT 2013 | markhoch
Thanks 'hege for the info. Have you seen a reduction in solder defects after switching from Air Reflow to N2 Reflow? I'm curious, because in my experience of over 20 years, working at five different companies, (Jabil being one of them), I've never u
Electronics Forum | Fri Dec 06 14:39:52 EST 2013 | davef
Depending on how much you require, there may run into some minimum material thresholds. * Research on 3M website: http://solutions.3m.com/wps/portal/3M/en_US/Electronics_NA/Electronics/Products/Product_Catalog/~/All-3M-Products/Industry-and-Professi
Electronics Forum | Mon Feb 24 12:41:18 EST 2014 | mi
Depending on what X-Y centroid / CAD data you need, there are different SW I've used to do the job. If you need PCB gerber "artwork" (rounds, rectangles, lines, squares,...geometric figures), you can use GraphicCode GC-Place & such - load the gerber
Electronics Forum | Fri Jan 31 09:38:58 EST 2014 | pavel_murtishev
Hello, I am trying to estimate hole filling after PiH process using phoenix x|aminer X-Ray Machine. The question is how to select correct inspection voltage? Inspecting at 60kV 40uA all PiH holes appear to be completely black, that means completely
Electronics Forum | Thu Apr 03 17:50:53 EDT 2014 | rboguski
We use it almost exclusively in manual mode for PCBA failure analysis. Our main purpose is to find head-in-pillow defects; secondarily incomplete wetting of ball to substrate. In two years of almost continuous use we have only had occasion to use t
Electronics Forum | Wed Apr 23 09:38:05 EDT 2014 | rgduval
Get in touch with your paste manufacturer. They should have a data base of different oven types/zones, and can give you "baseline" settings for a medium thermal density board that has been proven to work well with their paste. After that, it sounds
Electronics Forum | Mon May 12 15:13:29 EDT 2014 | emeto
Thank you guys. As we are speaking I keep examine the problem and here is what I got so far. 1. I measured the temperatures on my profile and the lead is hotter than the board. The lead goes 12 seconds earlier than the pad and is taking the solder.
Electronics Forum | Mon May 26 04:39:49 EDT 2014 | sarason
Damn near impossible. You need to see a real change in the difference between the 2 elements you are reading. So to give yourself any hope run 2 long traces one top one bottom up the length of the board. Then compare to 2 wriggly traces at one end (o
Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah
Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad
Electronics Forum | Wed May 28 19:21:09 EDT 2014 | hegemon
Just from the look of things (a picture) I would first guess it is a contamination problem on the PWB. Check over all your handling practices. Make sure the PWBs are NEVER touched by bare hands. I would not rule out the Black Pad phenomena, but i