Electronics Forum: stencil (Page 527 of 572)

Solder paste layout

Electronics Forum | Thu May 10 16:17:59 EDT 2001 | davef

I am unaware of any industry standard for specifying apertures for SM stencils. I am aware of IPC-7525, Stencil Design Guidelines. You can obtain it from IPC [http://www.ipc.org]. Further, it seems like there is an article on stencil design ever

PIHR Inspection Criteria

Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis

Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just

Re: Solder Beading Solder Balling

Electronics Forum | Fri Aug 06 06:13:37 EDT 1999 | Wolfgang Busko

| | | | | | | | | | | | | | | | | | Hello, | | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

Rep Responses in Forum, Possible Guidelines

Electronics Forum | Mon Oct 14 12:56:50 EDT 2002 | davef

His technical contribution to the forum. From these 24 postings, we can see that 75% of Sean�s postings have a decided commercial bent, as followings: * Could be argued that the posting is a good technical response. Percent of postings 25%. * Could

solder ball after reflow owen

Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks

Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a

Flason SMT Products

Electronics Forum | Wed Oct 03 23:59:44 EDT 2018 | gaintstar

Flason SMT problem solving: http://www.flason-smt.com/new/PRINCIPLE-OF-SURFACE-MOUNT-PROCESS-SMT-PROCESS.html http://www.flason-smt.com/new/Printed-Circuit-Board-PCB-Price-Estimator.html http://www.flason-smt.com/new/Printed-Circuit-Board-Solder-res

Re: Dbl-Sided Reflow Question

Electronics Forum | Fri Jun 02 17:33:51 EDT 2000 | Dave F

Hey CK, we�re all sodder googoo�s ... wanna be gurus Why donchu tell �em not to put sodder in your vias? Er, makit so the sodder won�t flow out of the bottom of the vias and cause dem stalactites? OK OK, here�s wacha do, modify the second side ste

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 15:10:14 EDT 1999 | Ian T

| | | | | Hello everyone, | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in ad

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Wed Aug 25 01:25:49 EDT 1999 | Gyver

| | | | | | Hello everyone, | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks i


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