Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS
Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125
Electronics Forum | Thu Mar 22 17:24:19 EDT 2007 | coop
Have you tried changing the algorithym type in mark info. to special 1 or 2 ? you will have to perform an F6 on this after you change it. If you were on Normal before then you will want to lower the threshold from the what you have it set at ,probabl
Electronics Forum | Tue Mar 27 10:38:04 EDT 2007 | johansenng
Hi, sorry but i am new in this. This is a Freescale SRB ZigBee node schematic design. 1)Can anyone help me identify what is the use of the 10K ohm resistor (R115) used? Seems that there is some advantages and disadvantages of using it. The source is
Electronics Forum | Fri Feb 26 08:30:10 EST 2010 | davef
Low cost prototyping * TWS Automation Quadra [www.tws-automation.com 39 0585 634758] * Versatronic RV4 [VSMT Solutions Ltd; 6 Dean Way, Aston Clinton, Aylesbury HP22 5GB, Buckinghamshire; 01296 630341 F01296 632144 http://www.vsmt.co.uk; David Clemen
Electronics Forum | Thu Nov 15 10:19:05 EST 2012 | davidmercader
Hi, We have problems with our wave soldering process. The problem is that during the same assembly, after wave soldering, some pcb’s look not clean and other pcb’s look good. We use lead free SAC305 solder and flammable flux. We think our proces
Electronics Forum | Wed Jul 29 17:43:26 EDT 1998 | Steve A
| Hi, good friends | I found this site is so wonderful to learn SMT techniques meaningfully. | We now employ 3 Fuji GL-541 dispensors and raw material with Soma IR-120. but we found glue string casually. From my experience from trouble-shooting the c
Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis
So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free
Electronics Forum | Thu May 03 10:23:33 EDT 2001 | davef
Yes, Alpha's frames help develop upper body strength. All stencils, regardless of the type of frame, can have loose foils. Stencils with removable foils require a specialized storage system for the foils and lots of band-aids. Some foil frame su
Electronics Forum | Sun Jun 10 12:15:37 EDT 2001 | procon
Hello Danial, Leave it up to most to blame the relow oven for their tombstoning problems when in fact it is usually the last to cause it. The biggest culprit of tombstoning is the pad design followed by the print quality. Usually, we find that the p
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
