Electronics Forum | Mon Oct 27 20:01:00 EDT 2014 | rangarajd
Hello, We are facing solderability issues on a particular lot of board. THe Nickel thickness measured with an XRF is around 400 U inches. Spec calls out for 130 u inches Nickel and 3 - 5 U inches gold over it. Assuming there is no porosity on the g
Electronics Forum | Wed May 09 17:28:25 EDT 2018 | davef
You can't find a hardness spec for immersion gold [ImAu] because no one cares. The ImAu dissolves into the solder during thermal processing. Pressed, I'd guess for that ImAu hardness is about that of soft gold * Soft: 50-90 knoop * Hard: 130-200 k
Electronics Forum | Thu Jan 31 16:07:13 EST 2019 | dwl
Have you considered looking into using am EMS provider instead? 130k is a very small budget to set up an SMT line capable of placing and reflowing 0201's. At that price point, you will need to go with used equipment. Do you have the knowledge, time a
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
Electronics Forum | Mon Apr 23 07:19:23 EDT 2001 | dahsr
Can I have solder bridging two SM rectangular chip components due to misalignment? The bridging occurs at one end and is on a common trace between the two pads. The components are larger than the pad (side overhang) and are aligned rather perfectly w
Electronics Forum | Fri May 21 10:16:31 EDT 1999 | Parvez
Dave, i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered to b
Electronics Forum | Mon Jan 25 13:56:45 EST 1999 | Parvez Patel
Chang Hong while developing our CSP rework process, we found a temperature spread of about 130C at a distance of approx 150 mils from the component edge. our nozzle had about 20 mils clearance from all sides of the component being reworked. depending
Electronics Forum | Tue Apr 23 14:39:49 EDT 2002 | mkallen
Here's a related question: How hot can a PBGA get before popcorn delamination becomes a concern? 100 C? 150C? I realize that the answer will depend upon the conditioning of the part, so let's assume that the part is saturated with moisture. A pra
Electronics Forum | Thu Apr 18 17:00:05 EDT 2002 | JamesL
We do cleanliness testing each morning using a Zero Ion tester. Our pass/fail number is set at 37ug/square inch NaCl. We are rarely above 10ug/square inch NaCl. We use Aqueous flux. Our inline washer has a prewash (70psi@130 degrees F), wash (?psi),
Electronics Forum | Tue Jun 04 17:05:52 EDT 2002 | davef
Solder balls floating around on the air currents of a reflow oven. I sincerely doubt it. Could the solder on your gold fingers be from: * Excess placement force during P&P? * Ejactula from solder deposits during rapid preheat ramp rates? * Ejactula
