Electronics Forum | Thu Dec 06 09:18:12 EST 2018 | ameenullakhan
Hi Betty , Its around. 215 to 220 deg C
Electronics Forum | Wed Nov 21 19:45:36 EST 2001 | Yngwie
Hi Guys, I need help. I�ve a trouble with non-wetting problem on the lead of 208 pin, 20 mils pitch QFP. We are on intrusive reflow. I never faced this problem before on this product after running them for about 2 years now. This occurred on one pa
Electronics Forum | Fri Sep 22 12:37:18 EDT 2000 | jonyoder
I am having problems with SMT electrolytic capacitors expanding and changing values after going through our reflow. The reflow profile we use includes temperatures of 200 deg C for 60 seconds and 230 deg C for 30 seconds. We need to use this profil
Electronics Forum | Mon May 31 19:20:50 EDT 1999 | Raeto Zryd
I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave soldering ma
Electronics Forum | Mon Jun 22 13:56:17 EDT 1998 | Upinder Singh
hi all. I am looking for a oven which can cure the conformal coating providing heat and the humid atmosphere. I am looking for a temperature range of 60 deg C to 80 deg C and a humidity range of around 80%. Can anybody refer to me the right vendors
Electronics Forum | Thu Apr 11 14:20:29 EDT 2002 | sleech
We have just introduced a new drying process that operates at only 55 deg. C and has proven to be able to drive moisture from tape and reeled devices or compontents in shipping tubes as effectively or more effectively as a convection oven at 125 deg
Electronics Forum | Wed Jan 05 15:54:51 EST 2005 | Frank R.
Hi, Now in my wave the PCB TOP Side temperature before WAVE is 110 - 115 DegC and the Peak temp in the wave is 240 - 245. These informations are for an 63/37 Alloy. What is the PCB TOP Side temperature and the peak temperature for Lead Free Wave Sn
Electronics Forum | Mon Jun 13 01:31:36 EDT 2005 | buchi79
Devef, The stand off height is 75micron. We only clean the product after underfill process. Dispense epoxy under the FC & cure it before aqueous wash. Samples are sent for LPC (liquid particle count) Test to ensure cleaniness. By the way, our plant
Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck
Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time
Electronics Forum | Wed Oct 04 14:18:05 EDT 2006 | C.K. the Flip
The main cause of voids is your flux out-gassing during reflow. Try a little "knee" or slight soak in your thermal profile to dry out the volatiles a bit. Typical soak ranges from 130 deg. C to 170 deg. C for around 30-90 seconds.
