Electronics Forum | Thu Jul 16 10:40:12 EDT 2015 | migliore
Hi, Question 1: can anyone explain me what the VIA ASPECT RATIO is? Question 2: Let's say that a PCB manufacturer specifies a VIA ASPECT RATIO of 8:1. Can I have vias of drill diameter of 0.1 mm on a 2L board 1.6 thick? thanks, Enrico Migliore
Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire
Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a
Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire
Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a
Electronics Forum | Thu Oct 26 17:48:47 EDT 2000 | Dave F
In response to your questions: 1) Suggestions on substrate material FR-4 or something better? Most PBGA are on BT. That might good for you, also. 2) Are there design guidelines for wire bonding pattern on the substrate? Several things: 1 Doesn�t
Electronics Forum | Sat Aug 21 12:38:09 EDT 1999 | Earl Moon
| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototypi
Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2
Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa
Electronics Forum | Fri May 17 20:11:32 EDT 2013 | isd_jwendell
I am familiar with TI's documents on QFN mounting. I do not have an X-Ray machine, so I worry about excessive voiding that could happen with using the thermal vias improperly. As a general rule-of-thumb, I print paste with a 25% reduction on the ther
Electronics Forum | Thu Jul 27 11:47:02 EDT 2000 | Jason
i've rotated the board with the same result. What are soldertheif pads. I'm new to wave soldering and this is another new one on me. What did you use? where do you put the pads? please explain as much as you care to...also my leads are 1mm and th
Electronics Forum | Thu Jul 27 11:47:15 EDT 2000 | Jason
i've rotated the board with the same result. What are soldertheif pads. I'm new to wave soldering and this is another new one on me. What did you use? where do you put the pads? please explain as much as you care to...also my leads are 1mm and th
Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar
Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t
