Electronics Forum | Tue Nov 15 06:46:41 EST 2005 | cyber_wolf
We have an earlier version of TPSYS. 2.4.1c We see this happen occasionally as well. It only seems to happen on our MY-12 machine. Our TP-11's never do it to my knowledge. I highly doubt that it is isolated to your company. If your machines are new,
Electronics Forum | Mon Dec 26 13:31:16 EST 2005 | mariss
Addendum: The boards are 2" by 2.4" (50mm by 60mm) and have 158 SMT components and 20 thru-hole parts. The nine X7R caps are distributed over the board; some are in the middle, others are near the V-grooved board edges. There is no discernable rel
Electronics Forum | Thu Apr 27 23:42:36 EDT 2006 | ajca20
Well the first thing you should know is once Mydata comes out with a new version, the older one is done. We have upgraded to the 2.4.4 and it it was well worth it. We increased our speed because the Agilis LM magazines are faster. Mydata always adds
Electronics Forum | Wed Jul 12 08:57:58 EDT 2006 | Evamaria
Mike , Look at http://www.circuittechctr.com, Guidebook, section 6,6.1. This method of attaching jumper wires is in accordance to the acceptability criteria of IPC-A-610 section 11.2.4.3. You did not specify what wire AWG is. I am assuming it is sma
Electronics Forum | Thu Dec 07 20:28:07 EST 2006 | davef
When rushing to get a job done, it's easy to accidently remove solder mask from a nearby via when dressing BGA pads after removing the part. Just hit the via with some super glue [then say a small prayer] and push on. As an alternative, look here:
Electronics Forum | Tue Jan 09 11:25:45 EST 2007 | gerryb
Because of some mechanical issues we believe that we need to counterbore 2 holes on one of our 2.4mm pcbs. We want to counterbore to a 0.5mm depth. The unplated hole is 4mm diameter and the counterbore diameter is 7.5mm. We have never done this befor
Electronics Forum | Tue Jan 06 09:33:06 EST 2009 | blnorman
Years ago when we ran a solder paste evaluation we used the 2.4.44 method mentioned above. What we did was to print several coupons and let them sit for various times to see how the tack changed over time. Our goal was to see how long after print w
Electronics Forum | Wed May 19 15:42:46 EDT 2010 | davef
Hear ya. Mostly, we production people. So, we shy away from home brew soldering techniques, unless we get ourselves in a mess. That being said, there's a fair amount of stuff on the web about home brew BGA and fine pitch QFP soldering. Here's an
Electronics Forum | Wed Dec 05 18:19:39 EST 2012 | cnotebaert
You should talk to your paste/flux manufacture! They will provide the best instruction for this. The norm is typically 130-145f, speed 2-4f/m I always push for slower… the slower the cleaner/drier (in theory!), if you have an ICOM, Omega meter, ionog
Electronics Forum | Tue Apr 23 15:35:45 EDT 2013 | dyoungquist
Check out IPC-A-600. Revision G (July 2004) section 3.2.3 (surface) and section 3.2.4 (internal) give min/max thicknesses for various weight copper. The min also changes depending on what class (1-3) standard you are working to.
