Electronics Forum: 2mm (Page 6 of 25)

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o

Hi Jandon, Thanks, I will try it on my DOE.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw

Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97

Use a type 5 solder for maximum paste release.

Temperature Profile for 0.2mm Thick ENIG Flex PCB

Electronics Forum | Thu Jan 30 07:19:23 EST 2020 | dontfeedphils

I'd post an image of your current profile if you could. Have you tried a RTS profile instead of a RSS?

Temperature Profile for 0.2mm Thick ENIG Flex PCB

Electronics Forum | Fri Jan 31 00:20:47 EST 2020 | jineshjpr

Thanks for your response, yet to try with RTS Solder profiles, Have you any additional comments on this RTS Temperature specifications like Time above liquidus, Peak temperature if any..??

Temperature Profile for 0.2mm Thick ENIG Flex PCB

Electronics Forum | Fri Jan 31 00:21:28 EST 2020 | jineshjpr

Thanks for your response, attaching the solder profile for your verification. The part NXP Make PCA2002 Micro BGA 8Ball Package.

How do I adjust table height EKRA X5 Screen Printer?

Electronics Forum | Tue Aug 04 04:20:36 EDT 2020 | bangir

Hi Chris, It's arround +/- 2MM. There was a gap if running pcb with thickness 1MM. The PCB position below the rail table.

Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 08:40:37 EDT 1999 | Wister

Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl

Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 08:38:15 EDT 1999 | Wister

Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl

Baking components at 70 degree

Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla

We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n


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