Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o
Hi Jandon, Thanks, I will try it on my DOE.
Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw
Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.
Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97
Use a type 5 solder for maximum paste release.
Electronics Forum | Thu Jan 30 07:19:23 EST 2020 | dontfeedphils
I'd post an image of your current profile if you could. Have you tried a RTS profile instead of a RSS?
Electronics Forum | Fri Jan 31 00:20:47 EST 2020 | jineshjpr
Thanks for your response, yet to try with RTS Solder profiles, Have you any additional comments on this RTS Temperature specifications like Time above liquidus, Peak temperature if any..??
Electronics Forum | Fri Jan 31 00:21:28 EST 2020 | jineshjpr
Thanks for your response, attaching the solder profile for your verification. The part NXP Make PCA2002 Micro BGA 8Ball Package.
Electronics Forum | Thu Apr 30 23:21:52 EDT 2020 | SMTA-Davandran
I am seeing a lot of solder ball for PIP process. is it due to the paste height go beyond 0.2mm.? what is the DOE need to focused for PIP process?
Electronics Forum | Tue Aug 04 04:20:36 EDT 2020 | bangir
Hi Chris, It's arround +/- 2MM. There was a gap if running pcb with thickness 1MM. The PCB position below the rail table.
Electronics Forum | Thu Sep 02 23:59:35 EDT 2021 | mokshamanthra
Hi, We have a PCB with layers defined for a thickness of 1.6mm from a customer . Is it possible to make it 2mm without affecting any Cu traces or layers , just by altering the FR4 material only.
Electronics Forum | Fri Apr 21 15:31:33 EDT 2023 | jamesatqkits
I had also increased my flux to see if that helped, it did not. 2mm lead length, 5.08 spacing Thank you
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