Electronics Forum: 3

Universal GSM1 startup error

Electronics Forum | Tue Aug 04 12:11:56 EDT 2015 | bnorton

OS/2 UIC version 3.2.3 Powerup seems to go OK until, while the GUI says ...initializing..., an error popup appears saying "Did not receive request to load machine model within timeout period. Possible machine error condition exists. Do you want t

Disassembling a Fuji CP4-2

Electronics Forum | Fri Nov 20 01:00:50 EST 2015 | anilwagh

I am looking below parts of CP4-2. 1)1P150E-24-2 3)2MMB500U-01-1 3)3MMB50-4-1 4)4P300E-05-1 5)CACR-SR03BC IKS-Y264-1 6)CACR-SR10BC 1KS-Y262-1 7)CACR-SR44 BC 1BF-Y279-1

How to connect to TpSys by socket?

Electronics Forum | Thu Jan 19 12:33:23 EST 2017 | vercek

Hello Jorge, Have you been able to complete your C# app? I manage to do so for TPSYS 3.2 which uses PostgreSQL database. I'm looking to do the same with TPSYS 2.4. I understand it doesn't use SQL database. I'm looking for the type of database it a

loss of metalization on a Earth Pad on a chip component MPN-SBSGP5000102MXT

Electronics Forum | Mon Aug 24 21:16:57 EDT 2020 | smith88

I am trying to teach a class and the question came up about loss of metalization of the Earth pad on a chip filter. This pad is on the side of the component. I can not find a IPC call out for this type of side termination other than 3 or 5 sided 9.1.

Conveyor chain in Rehm reflow oven is still running after "Auto Off" prosedure has been activated.

Electronics Forum | Mon Mar 20 15:41:00 EDT 2023 | oclsc

Hallo SMTnet. We have just bought a VXS Air 3.2/634 Rehm reflow oven. We are wondering why the conveyor chain in the oven is still running two days after the "Auto OFF" precedure/program has been activated. In this case the oven set to "Auto Off" Fr

IPC/JEDEC J-STD-033D - 3.3.2.2.1 Desiccant Quantity Calculation

Electronics Forum | Wed Nov 24 21:03:57 EST 2021 | djenkins62

Hello Everyone In Board World, Looking for some discussion on calculating how long moisture sentive boards can be stored on shelves with forum in 3.3.2.2.1 Desiccant Quantity Calculation When the desiccant capacity at 10% RH and 25 °C is known, th

Re: Printed Circuit Board Material

Electronics Forum | Wed Oct 18 16:41:35 EDT 2000 | Dave F

It's unrealistic to think that two materials with the following disperant properties would have the same reflow profile. From http://www.norplex.com/Carrier.htm Physical Properties / NEMA FR-4 / NEMA CEM-1 Glass transition temperature �C / 130 / 10

GSM USOS 3.2.3 patch

Electronics Forum | Tue Oct 11 09:26:42 EDT 2011 | dilogic

For all of you that are using this version of GSM USOS, I've made a patch that changes default fiducial repair drop-down menu from "Reteach Fiducial" to "Alignment Done". We had a large batch of boards with lousy fiducials and it drove me crazy havin

Stacking Chip Components

Electronics Forum | Wed May 27 13:50:38 EDT 2015 | ingallsd

I saw a question regarding the acceptability of stacking chip components at this forum posted in 2000. Unfortunately no one could cite any applicable IPC sections at that time. I am now able to find that this is acceptable per IPC-A-610D, Section 8.

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F

| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n


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