Electronics Forum | Thu May 21 09:41:34 EDT 1998 | Gary simbulan
| | | | | 310-433-7000 Topline | | | 714-899-8309 Practical Components | | | | Thanks for the numbers Michael, but I am still getting a "this number has been disconnected" message for TopLine. Maybe their competitor has what I need | | Gary | Gar
Electronics Forum | Tue Jul 16 07:16:36 EDT 2002 | davef
I know Interconnect Systems [708 Via Alondra Camarillo CA 93012 805.482.2870 fax 8470 isipkg.com ] does converters [BGA/BGA, BGA/QFP, BGA/PGA, etc] like you seek. Other places to try are: * Aries 908.996.6841 * Antona 310.473.8995 * Oztech 510.782.2
Electronics Forum | Sat May 24 07:21:51 EDT 2003 | davef
Try: * Aries 908.996.6841 * Antona 310.473.8995 * Oztech 510.782.2654fax2656 * Emulation Technology 408.982.0660 800.232.7837 fax 0664 emulation.com * Interconnect Systems (BGA/BGA, BGA/QFP, BGA/PGA) 708 Via Alondra Camarillo CA 93012 805.482.2870 fa
Electronics Forum | Mon Mar 29 14:58:08 EST 2004 | davef
Josh: Final cure of the LPI solder mask: 310*F for 45 minutes. Your board fabricator needs to do a better job. Most fabs do not check cure, because the processes subsequent to cure are so brutal that the fab expects the following process to highlig
Electronics Forum | Mon Jan 23 14:09:14 EST 2006 | gipos
Hi Pavel, Thank you for your time.We wonder if anyone have experience with Panasonic - Panasert reflow oven model REF-A.It is used in Asia a lot. We have to chose among few models of reflow ovens : 1.Panasonic REF-A 2.Hollis(Electrovert) model Sur
Electronics Forum | Mon Oct 02 10:50:02 EDT 2006 | bradlanger
Bob, I agree that these are all board shop issues. I think the only one that is related to the Hasl process is the surface mount solerability issues. I think they are still putting the coating on too thin even though they say it is fine. This proble
Electronics Forum | Tue Jul 13 13:37:23 EDT 2010 | pjc
That's cold compared with this specification from a leading oven mfr.: Flow Rate - 1.0 - 3.0 US gal/min (3.79 - 11.4 l/ min) • Inlet size and pressure - 0.5 in. male NPT; 310 - 483 kPA (45 - 70 psi) • Pressure drop - 200 kPa @ 11.4 l/min (30 psi @ 3
Electronics Forum | Tue Oct 04 20:18:17 EDT 2011 | denmark
Sir *We are using "HOT BAR SOLDERING" we are bonding "FFC" and "PCB" at 0.5mm pitch. Machine settings: Heating Temp. 310º, Colling Temp. 190º Delay Time 1sec We also using "BECKLITE" as Soldering Jig that can resist up to 400º. We are using 1 is to
Electronics Forum | Tue May 02 05:35:07 EDT 2000 | Donnie
There are a number of different things to ask youreself here. What type of flux are you using. 330, 351, 310 etc. Do you have a hot air knife? As for the residue, that's gonna show on almost any wave soldered pcb. We have fought the issue for a long
Electronics Forum | Fri May 14 12:01:40 EDT 1999 | Chrys Shea
| | | I am looking for anyone who has converted over to VOC Free flux. I need some info on any problems, etc. that you might have had. | | | | | | Please E-mail me at wes.ruggles@vickers-systems.com or call at (513) 494-5229 | | | | | | Thanks | |
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