Electronics Forum | Wed May 04 10:42:55 EDT 2005 | nice90
Handling a PCB 1. Check your ESD slippers and ESD Strap first before entering the SMT production line 2. A PCB manufactred over 90 days must be stored first on the baking Oven before Production 3. Temperature on the Baking oven must be 125plus and m
Electronics Forum | Mon Nov 25 22:08:05 EST 2002 | Ben
Thanks for the advise. I got the advise from my solder paste vendor to increase the time above melting point for flux outglassing to escape. I tried but no big help. For the moisture issue, actually I've try to bake both the PCB and components at 12
Electronics Forum | Tue Jun 26 21:41:10 EDT 2007 | davef
4.4 Determine the amount of flux on the board. 4.4.1 Get a piece of corrugated cardboard and a weighing scale accurate to 0.01 grams. NOTE: Use cardboard with alcohol fluxes to slow their evaporation and get good data. 4.4.2 Weigh the cardboard. 4.4
Electronics Forum | Wed Aug 21 17:50:05 EDT 2002 | davef
First, it�s GREAT that your defect rate of 282 is very close to your Boss� goal of 50 ppm. Second, your Cpk and your ppm numbers don�t tie out with our expectations. You say Cpk for: * mounter is 1.0 and �your mounting is 83ppm�. * printing is 1.33
Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris
I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog
Electronics Forum | Wed Nov 15 10:26:54 EST 2000 | Rkevin
I'm looking for what I call Mylar, for lack of a better name. We used it at Digital/Compaq to help us knead paste and also to check alignment of prints without actually applying any paste to the module. It was about 4-5 mils thick, clear and came in
Electronics Forum | Wed Nov 15 10:24:23 EST 2000 | Rkevin
I'm looking for what I call Mylar, for lack of a better name. We used it at Digital/Compaq to help us knead paste and also to check alignment of prints without actually applying any paste to the module. It was about 4-5 mils thick, clear and came in
Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef
I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo
Electronics Forum | Sun Jan 30 21:56:05 EST 2000 | Paulvannan
We used Promosol Sn96.5/Ag 3.5 during our initial qualification for similar application. We could not achieve a shiny solder joint. Our changes to Sn95.5/Ag 4.5 does not improve the look. In order to confirm the reliability of the joint, I suggest yo
Electronics Forum | Mon Nov 29 16:17:43 EST 1999 | Curtis T.
Are these blades coated with something like PTFE (teflon)? If so does the coating flake off over time. Incidently I just got a pice quote and they are 4.5X that of our standard MPM nickel plated spring steel, so I wanted to make sure they would last
