Electronics Forum | Wed Oct 08 14:47:45 EDT 2008 | slthomas
We used to have fids filled with epoxy too, but they were never cut all the way through. It was just to blacken the mark better. Are you sure they were actually cut through? I can't imagine something as brittle as epoxy holding as a filler with not
Electronics Forum | Wed Sep 07 03:03:35 EDT 2005 | Milroy
I am engaged with SMT production and we are going to have a brand new SMT line and I am studing about the screen printing and I have seen most commonly used stencil thickness is 6mil and I need to know what is the best solder paste height we can achi
Electronics Forum | Thu Sep 08 03:40:59 EDT 2005 | GS
do not forget also wich Type of paste used( granulometry) if Type-3 ? Type 4? etc, it could change in final metal on your pads/joints. Regards GS
Electronics Forum | Fri Nov 19 22:48:26 EST 1999 | mark
Steve, your comments from your stencil vendor are very interesting. Any decent laser cutter automatically cuts a trapezoidal aperture. This is just the nature of the cutting. We have a bunch of lasers (and chem-etch). You have to polish your laser cu
Electronics Forum | Thu Sep 08 01:58:08 EDT 2005 | darby
0. Any less and you are scooping the paste from the aperture with the squeegee blades. I'm not saying that either of these situations is a good or a bad thing, it's just that if you buy a 6 mil stencil, you are trying to achieve 6 mil paste height.
Electronics Forum | Mon Oct 25 15:23:26 EDT 1999 | Dave F
Ron: You're really talking about a step-up stencil in the area of the BGA. I don't think your problem is a lack of solder, but who know? I think you should do some sections on returned boards from your customer to help determine the source of the
Electronics Forum | Tue May 06 21:35:27 EDT 2014 | davef
Indium recommendations: 0201's: * Stencil Opening = 11mil x 16mil rectangle * Foot Print = 12mil x 15mil rectangle * Stencil Thickness = 5mils * Spacing = 9mils Note: The most common stencil being utilized, is the laser cut electropolished, and in so
Electronics Forum | Fri Aug 27 13:31:47 EDT 1999 | swsng
1.5 FATOR FOR 20MILS QFP REDUCE 2 MILS HEEL AND INCREASE 2MIL AT TOES AT SIDES -1MILS EACH. SWSNG
Electronics Forum | Fri Apr 11 01:52:26 EDT 2008 | andrzej
0,66 Is it ok ? Is it overprinted r - radius of stencil aperture - 9mils ~ 230um t - stencil thickness - 150um Other data : diameter of soldermas - 26mils Diameter of pad - 18mils Diameter of stencil apertre - 18mils Pitch - 0,8mm ~ 31mils What s
Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck
Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks
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