Full Site - : aluminum wedge bond (Page 6 of 35)

MVP 850 DWMS

MVP 850 DWMS

New Equipment | Inspection

The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-

Machine Vision Products, Inc

Oak Mitsui Inc.

Industry Directory | Manufacturer

Oak-Mitsui specializes in the development and production of world class performance foils, Aluminum Bonded Copper, and FaradFlex� Buried Capacitance� materials.

Kapp Copper-Bond Flux 500°F - 750°F (260°C - 390°C)

Kapp Copper-Bond Flux 500°F - 750°F (260°C - 390°C)

New Equipment | Solder Materials

Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux

Solder Direct

Kulicke & Soffa Pte. Ltd.

Industry Directory | Manufacturer

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments.

EWI SonicSolder

EWI SonicSolder

New Equipment | Assembly Services

S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join

S-Bond Technologies

Nordson MARCH AP-300

Nordson MARCH AP-300

Used SMT Equipment | Semiconductor & Solar

Nordson MARCH AP-300 Plasma System Cleaner 100-230VAC, 50/60Hz, 3.5A @208V, Single Phase A compact and benchtop model, the Nordson March plasma system AP-300 has a volume capacity of 33.1 liters, supported by up to seven (7) adjustable shelves in

LEL Tech

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

4000 Series Bond Testers

4000 Series Bond Testers

New Equipment | Test Equipment - Bond Testers

Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon

Nordson DAGE

Indium's NanoBond® Process

Indium's NanoBond® Process

Videos

How the NanoBond® Process works

Indium Corporation

Hesse & Knipps is now Hesse Mechatronics.

Industry News | 2013-03-06 10:33:14.0

Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.

Hesse Mechatronics


aluminum wedge bond searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

Easily dispense fine pitch components with ±25µm positioning accuracy.
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Software for SMT placement & AOI - Free Download.
2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"
PCB separator

Find a wide selection of nozzles, solder materials, storage solutions and more at SALESCON