Full Site - : aluminum wedge bonding (Page 6 of 35)

MVP 850 DWMS

MVP 850 DWMS

New Equipment | Inspection

The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-

Machine Vision Products, Inc

Oak Mitsui Inc.

Industry Directory | Manufacturer

Oak-Mitsui specializes in the development and production of world class performance foils, Aluminum Bonded Copper, and FaradFlex� Buried Capacitance� materials.

Kulicke & Soffa Pte. Ltd.

Industry Directory | Manufacturer

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments.

Kapp Copper-Bond Flux 500°F - 750°F (260°C - 390°C)

Kapp Copper-Bond Flux 500°F - 750°F (260°C - 390°C)

New Equipment | Solder Materials

Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux

Solder Direct

Nordson MARCH AP-300

Nordson MARCH AP-300

Used SMT Equipment | Semiconductor & Solar

Nordson MARCH AP-300 Plasma System Cleaner 100-230VAC, 50/60Hz, 3.5A @208V, Single Phase A compact and benchtop model, the Nordson March plasma system AP-300 has a volume capacity of 33.1 liters, supported by up to seven (7) adjustable shelves in

LEL Tech

EWI SonicSolder

EWI SonicSolder

New Equipment | Assembly Services

S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join

S-Bond Technologies

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

Indium's NanoBond® Process

Indium's NanoBond® Process

Videos

How the NanoBond® Process works

Indium Corporation

Hesse & Knipps is now Hesse Mechatronics.

Industry News | 2013-03-06 10:33:14.0

Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.

Hesse Mechatronics

Hesse & Knipps is now Hesse Mechatronics

Industry News | 2013-03-06 10:36:50.0

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.

Hesse Mechatronics


aluminum wedge bonding searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for Selective Soldering Needs

High Throughput Reflow Oven
One stop service for all SMT and PCB needs

Training online, at your facility, or at one of our worldwide training centers"
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World's Best Reflow Oven Customizable for Unique Applications
Voidless Reflow Soldering

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...


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