Electronics Forum | Wed Aug 22 13:16:23 EDT 2012 | rway
Most likely the depaneling is not your issue, but I do concur that there is some mechanical stress occurring somewhere. What about any fixturing for FT/ICT?
Electronics Forum | Thu Mar 26 19:13:15 EDT 2015 | vladig
Right. That's what we normally do for our customers in order to just qualify a process. I'd just add X-ray, particularly on a large BGAs. Regards, Vlad SENTEC TESTING Laboratory Inc.
Electronics Forum | Fri Mar 27 10:16:33 EDT 2015 | dyoungquist
A good resource for implementing/evaluating a BGA process is IPC-7095C - "Design and Assembly Process Implementation for BGAs". I get no monetary or other compensation for promoting that standard but it is fun to mention that a board assembled by my
Electronics Forum | Wed Aug 22 12:48:47 EDT 2012 | tpatrickwalsh
They are using the method where scored boards are separated using a rotating wheel / blade. I realize this is not the best process, however these capacitors are more than 10 mm from the edge of the board. From some reading online I think that means
Electronics Forum | Wed Aug 22 13:18:50 EDT 2012 | rway
I also forgot to mention that the pizza-slicers you are using can get out of spec and may need periodic calibration. By cutting too close, these can over-stress your pcbs as well. Do you only see this problem at one cutter or does it matter? Also,
Electronics Forum | Thu Aug 23 00:38:17 EDT 2012 | isd_jwendell
"The problem is we haven’t changed anything in our design, and this has never happened before in 4-5 batches of production." If nothing has changed (same parts, same oven profile, same de-paneling, etc.), could the parts themselves have changed? I h
Electronics Forum | Mon Aug 27 04:13:49 EDT 2012 | thmeier
Moisture should not be an issue with ceramics, but mechanical or thermal stress definitely is. Has there been rework on this capacitors? So check for handling /temperature of your soldering irons (better:use hot air). Check oven temperature/profile
Electronics Forum | Fri Mar 27 05:11:24 EDT 2015 | robertwillis
If you want a step by step guide on BGA look at my NPL/IPC "Defect of the Month" video clips https://www.youtube.com/watch?v=MC4K0eSXH18 For other process issues there are also videos which may assist on other process issues like voids, solder ball
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Fri Jul 27 12:21:18 EDT 2012 | tpatrickwalsh
I am posting this here because I think it may have something to do with PCBA: I have a simple battery-powered consumer product (LED light) that we have been manufacturing for some time. All of a sudden in one batch, we have about a 4% rate of a sing
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