Electronics Forum | Tue Apr 03 15:47:43 EDT 2018 | davef
Just to be clear: * First Article inspection is the qualifying of new product/processes and changes. Automotive PPAP approval is a good example. * First Piece inspection is the first off when a process is started.
Electronics Forum | Fri Sep 14 21:05:45 EDT 2018 | hossameldin
I am planning to buy SMT line for automotive products i need advise which machine is better to buy Yamaha YSM20 or Fuji NXTIII what disadvantages of each of them and advantages Thank you
Electronics Forum | Mon Jul 01 04:35:22 EDT 2019 | sssamw
It depends on your product application requirement, normally should not drop off board for automotive. Even the dropped board pass function test in plant, it will have problem in its working environment.
Electronics Forum | Fri Dec 20 00:10:55 EST 2019 | sssamw
Not really, if this is a normal consumer electronics, could be no big issue. Anyway flux residue provide ions and the substance absorb water or moisture. If for automotive or space, could have high risk, it depends your application.
Electronics Forum | Fri Mar 04 08:10:32 EST 2022 | leductho
We are big manufacturing site in Vietnam. Our factory are producing some key Customers' products such as phones, smart speakers, Automotive, IOT devices. We are looking for new customers who need EMS, OEM, ODM services.
Electronics Forum | Mon Jul 31 18:22:03 EDT 2023 | emeto
Complexity and volume are the main items in consideration. If you build automotive. they probably won't accept manual inspection only. They will require full automated traceability and 100% automated product inspection plan, before they hire you.
Electronics Forum | Tue Jun 03 12:24:50 EDT 2003 | blnorman
I have received information from the European Commissioners Environmental group that automotive electronics are not covered by WEEE (waste electrical and electronic equipment 2002/96/EC) or RoHS (reduction of hazardous substances 2002/95/EC) because
Electronics Forum | Mon Feb 28 12:01:30 EST 2005 | Bob R.
We use QFNs in automotive products and have done a good bit of experimenting with pad designs, paste patterns, stencil thickness, and thermal via patterns. All of them have an effect on assembly and thermal cycle reliability. There is not a yes or
Electronics Forum | Tue Jul 05 15:24:16 EDT 2005 | davef
60% assy Hutchison||150||150||Disk drive suspension||Flex only, no assy Parlex||130||75||Automotive||Low assy, increasing Innovex||95||40||Disk drive suspension||High assy in other applications Multtek Flex||64||64||Automotive||Low assy, increasing T
Electronics Forum | Tue Oct 18 04:44:44 EDT 2005 | dougs
these are two separate things, your MSA is measurement systems analysis, moving a machine won't change the way you measure your machines performance so you don't need to do MSA again. you should check machine capability once a machine is moved thoug
