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Level Transmitter PCB Assembly - Electronic Contract Manufacturing - Grande Electronics

Level Transmitter PCB Assembly - Electronic Contract Manufacturing - Grande Electronics

New Equipment | Assembly Services

Supplier: Shenzhen Grande Electronics Layers:2 Application: Level Transmitter PCB Assembly - Electronic Contract Manufacturing - Grande Electronics PCB: FR4/1.0mm, 1oz finished copper Min Via: 0.2mm Surface Treatment: HASL PCBA Lead time: 2-3 weeks

Shenzhen Grande Electronics Co., Ltd

Weighing Scales PCB Assembly - Fast Electronic Prototype‎

Weighing Scales PCB Assembly - Fast Electronic Prototype‎

New Equipment | Assembly Services

Supplier: Shenzhen Grande Electronic Layers: 4 Application: Weighing Scales PCB Assembly - Fast Electronic Prototype‎ PCB:FR-4/1.6mm, 2oz finished copper Specialty: Large current, High heat, heavy components Surface Treatment: HASL PCBA Lead time: 3-

Shenzhen Grande Electronics Co., Ltd

Attendance Control System Quick PCB Prototype Assembly- Shenzhen Grande

Attendance Control System Quick PCB Prototype Assembly- Shenzhen Grande

New Equipment | Board Handling - Conveyors

Supplier: Grande Electronics Layers: 4 Application: Attendance Control System Quick PCB Prototype Assembly- Shenzhen Grande PCB:FR4/1.6mm/1oz Min Via: 0.2mm Surface Treatment: HASL PCBA Lead time: 3-4 weeks Testing: 100% E-test Standard Warp: [D

Shenzhen Grande Electronics Co., Ltd

Auto BGA Rework Station

Auto BGA Rework Station

New Equipment | Other

Auto BGA Rework Station Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Weight:Approx.60KG Product description: Auto BGA Rework Station Optical Alignment, Demensions:L650

Flasonsmt Co.,ltd

Auto BGA Rework Station

Auto BGA Rework Station

New Equipment | Other

Auto BGA Rework Station Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Weight:Approx.60KG Product description: Auto BGA Rework Station Optical Alignment, Demensions:L650

Flasonsmt Co.,ltd

China BGA Rework Station factory

China BGA Rework Station factory

New Equipment | Other

China BGA Rework Station factory Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Weight:Approx.60KG Product description: China BGA Rework Station factory, PCB size:Max 40

Flasonsmt Co.,ltd

BGA Rework Station

BGA Rework Station

New Equipment | Industrial Automation

BGA Rework Station Demensions: L650×W630×H850mm PCB size: Max 400×390mm Applicable chips: Max 80×80mm Min 1×1 mm Weight: Approx.60KG  INQUIRY BGA Rework Station Specifications: Independent 3 heating zones temperature control system 1.The

Fomyn Equipment co,.ltd

China BGA Rework Station factory

China BGA Rework Station factory

New Equipment | Rework & Repair Services

http://www.flason-smt.com/product/China-BGA-Rework-Station-factory.html China BGA Rework Station factory Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Weight:Approx.60K

Flason Electronic Co.,limited

Flason SMT Assembly line Auto BGA Rework Station Optical Alignment

Flason SMT Assembly line Auto BGA Rework Station Optical Alignment

New Equipment | Rework & Repair Equipment

http://www.flason-smt.com/product/SMT-Assembly-line-Auto-BGA-Rework-Station-Optical-Alignment.html Flason SMT Assembly line Auto BGA Rework Station Optical Alignment Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicabl

Flason Electronic Co.,limited

Auto BGA Rework Station Optical Alignment

Auto BGA Rework Station Optical Alignment

New Equipment | Rework & Repair Equipment

http://www.flason-smt.com/product/SMT-Assembly-line-Auto-BGA-Rework-Station-Optical-Alignment.html SMT Assembly line Auto BGA Rework Station Optical Alignment Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips

Flason Electronic Co.,limited


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