Electronics Forum | Wed Feb 07 11:27:25 EST 2007 | asoe
I just wonder anyone had the idea of solderability test for through hole by using a wetting balance equipment? I read the jstd002/003 however my feel is now our machine (metronelec st60) is not capable of this test?
Electronics Forum | Fri Mar 09 14:31:56 EST 2007 | stepheniii
That also allows a channel for degassing and also breaks up paste into sections that tend to balance the forces acting on the part. So basically window paning is even better than you might think.
Electronics Forum | Mon Jun 25 18:15:14 EDT 2007 | ratsalad
Your placement machines are too fast. Slow them down and the line will be balanced. This is the easiest way to make the industrial engineers happy.
Electronics Forum | Fri Jul 13 04:58:01 EDT 2007 | pavel_murtishev
Good afternoon, Heating/Cooling rates contribute to warpage most of all. Try to tweak you profile so that heating/cooling rate would be minimized. Try to switch cooling blowers off maintaining required peak/TAL. Check copper balance for this PWB, by
Electronics Forum | Fri Jul 13 17:01:50 EDT 2007 | sean10
Thanks for your inputs. The board construction seams to be balanced and boards comes back to flat after top side process. we'll be performing experiement variing the profile parameters. if that does not do it, any printing suggestings? Would more sq
Electronics Forum | Fri Feb 22 08:13:02 EST 2008 | davef
Try: * Grainger [www.grainger.com] * Mc Master-Carr [www.mcmaster.com] Use a blast gate like McMaster-Carr 1822K315 located on each port of the machine. These will help balance the air flow entrance to exit as well.
Electronics Forum | Mon Feb 25 08:15:40 EST 2008 | davef
Search the fine SMTnet Archives on line balancing to find threads like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=53089
Electronics Forum | Fri Apr 16 14:32:50 EDT 2010 | flipit
Who is financially is good shape. Are any of these companies destined to be sold to someone else? I have good feeling about some of these but others I have concerns with. 1)Universal 2)Juki 3)Mydata 4)Siemens 5)Panasonic 6)Fuji 7)Samsung
Electronics Forum | Wed Jun 02 19:54:04 EDT 2010 | davef
Here's one take on what you seem to be asking: * After a point, more solder is more stress than the proper amount of solder would produce. * Asymmetrical amounts of solder produce more stress than balanced amounts of solder would produce.
Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef
You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.
