Electronics Forum | Fri Dec 17 00:55:22 EST 2010 | kemasta
Hi Kim Dun take any risk in delamination bcoz u > will be the person to answer for being it. So, > we do bake all Pcbs, which have 3months of shelf > life, b4 startin any process although they are > still inside the factory packs. We keep it in
Electronics Forum | Fri Aug 27 00:26:14 EDT 2004 | charly
hi, encounter few cases PCB was delam after reflow, and the supplier was refuse that this is a PCB manufacturing defect as the fallout is low within one lot. the cost for this scrap is high after PCBA level, my query here are 1) is there any way
Electronics Forum | Mon Sep 06 20:18:37 EDT 2004 | charly
hi, we are running high mixed low volume here, and i encounter many pcb delam after reflow issue. here some doubt need ur advise: 1. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? if i allow bare
Electronics Forum | Tue Dec 09 10:04:36 EST 2008 | lazzara55
SMT-ypw: Does PWB supplier start to implement PWB drying packaging? B3: YES! The fabrication of the PCB involves a series of wet processing that requires counter-measures to remove moisure. While some of the PCB processes also include bake cycles th
Electronics Forum | Tue Mar 30 22:30:06 EST 2004 | davef
Tony First, drying at 125*C for an hour is not going to do much drying. Heck, those boards are barely warm to the touch. Second, tell us about: * Pitch of your uBGA * Solder paste flux * Cleaning process and agents
Electronics Forum | Wed Nov 14 01:18:20 EST 2007 | reypal
How about your bare pcb handling? do you stuff smd component prior hand soldering? you can try to bake the pcb and then see if this problem still exist.
Electronics Forum | Tue Jan 06 14:37:27 EST 2009 | stevek
The easiest way to prove out the absorbtion theory is to weigh the parts before wash, after wash, and after baking. You probably want to do this with the bare parts in isolation as the fab will pick up considerable moisture. Differences in weight s
Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian
A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th
Electronics Forum | Mon Dec 08 17:06:59 EST 2008 | boardhouse
Hi MGL, Couple things to ask, have the boards recently been changed to Rohs builds? STD FR4 to High TD Laminate. Check the stack-up the board houses are using. Just about all Rohs laminate has Resin starvation issues when used in single ply co
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
