Electronics Forum | Fri Oct 22 19:07:29 EDT 2010 | jry74
To get out of a delivery pinch, I had to pre-tim some connectors because of contaminated leads. Make sure your selective wave speed and XYZ travel are close. Try doing a dry run across the board to preheat the PTH and then go back and solder them.
Electronics Forum | Thu Oct 28 00:59:31 EDT 2010 | emmanueldavid
Hi, An useful information (Bruneel is right) that concluded with a root cause Note. Appreciated Heguman, Bruneel & John. Many Thanks, David, India.
Electronics Forum | Mon Mar 17 10:26:36 EDT 2014 | cwwong1
Pls share with me the time cycle result for the THM component on board thickness 93 mils, I would understand the risk for not having to achieve soler barrel fill less then 50%.
Electronics Forum | Sat Dec 19 04:46:24 EST 2015 | padawanlinuxero
Hello I am curious about an anomaly we are seeing in the new profile for one of our products, we run it in a wave solder and after it gets solder we see that the fillets are not even, we have took x-rays of the terminal but we see 100% barrel fill,
Electronics Forum | Mon Jul 31 18:34:30 EDT 2023 | emeto
I have done some of these. Pin in paste process with generous amount of paste to fill the barrel properly. Pick and place process is tricky too, but if you get them on tape and reel, you can have a custom nozzle and have them placed.
Electronics Forum | Tue Jun 05 08:40:46 EDT 2012 | rway
How deep is the indent? I would say as long as it is hitting nothing but net (the solder fill), your fine. Besides, you should notice indents on your solder fillets of components on the top-side as well. This is also expected and acceptable.
Electronics Forum | Mon Oct 15 14:36:03 EDT 2018 | davef
The methods of verifying PTH hole-fill. 1 Visual inspection 2 x-ray inspection works very well for inspecting such a connector for voiding and hole fill. View the connector off-vertical, at between 30 and 45 degrees. As always, the solder connect
Electronics Forum | Mon Aug 11 17:48:39 EDT 2003 | Brian W.
Assuming you are working to IPC standards, are you working to Class2 or Class 3? Class 2 has an exception to the 75% barrel fill (para 6.3.1, page 6-7). "As an exception to fill requirements of Table 6-2 on PTHs with thermal planes or conductor
Electronics Forum | Mon Apr 18 12:14:39 EDT 2022 | proceng1
As far as hole fill, as was stated above, class 2 only requires 50% up-fill. In order to get better up-fill on the initial pass, you may need to consider more pre-heat. Also, better application of flux. Are you using a drop jet, or a spray? You
Electronics Forum | Tue Nov 13 21:59:42 EST 2007 | davef
This processes has the potential to cause barrel cracking and pad lifting, because the heating is very hot [troop crank-up the volume on their iron when they see thick boards] for a relatively small area on one side of the board. What do we suggest
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