Electronics Forum: bga and operator and rework (Page 6 of 8)

BGA: reworking BGAs, testing and inspection

Electronics Forum | Tue Feb 09 13:47:46 EST 2010 | davef

BGA rework equipment: Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=48736 Use x-ray inspection to identify the obvious defects such as shorts, missing balls and gross solder voids.

BGA: reworking BGAs, testing and inspection

Electronics Forum | Fri Feb 12 11:45:14 EST 2010 | ppcbs

Greetings, > > We are looking to purchase > equipment to rework / repair our circuit boards > with BGAs. Our newer boards are starting to have > more and more BGAs. > > Is there any information > that "ranks" BGA rework stations? - a kind of a

BGA: reworking BGAs, testing and inspection

Electronics Forum | Thu Feb 11 15:07:49 EST 2010 | hegemon

With regards to the rework, size and mass of the PCBs is important, in addition to the size of the components that are to be reworked. You might be in the game with $6K (APE Chipmaster Hot Air machine with Preheater or similar setup) if you have sma

BGA Device with Slanted and Damaged Spheres

Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS

I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,

Processing questions - PCB and BGA's

Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep

We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f

Re: Paladium Pillows and Bad Dreams

Electronics Forum | Wed Feb 25 01:24:34 EST 1998 | Steve Gregory

Dave, I confess I was a tad too general and a bit too extreme describing the way ALL solder joints look on palladium coated leads. I should been more specific about the "pillow-effect". I've seen it regularly with palladium coated leads on small SOT

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F

Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,

how many BGA and CSP do you place annualy?

Electronics Forum | Fri Mar 08 09:27:43 EST 2002 | Amir

hello guys and gals: we know that BGA placement or rework are such a pain in *** oh well! but i was wonder if you can help me to figure: how many BGA do you place on board annualy? (just a bulk park idea) do you rework BGA in house? do you think

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto

This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto

We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top


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