Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul
My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp
Electronics Forum | Wed Sep 25 10:56:27 EDT 2002 | xrayhipp
Yeah, perhaps lean more towards a ramp-to-spike profile - reducing the soak time and add a littel heat to your temp above liquid. This has worked for us with water soluable paste as we are not required to use no-clean and utilizing a 6-zone oven. G
Electronics Forum | Mon Jul 08 13:49:10 EDT 2002 | msjohnston
HI, We are looking into expanding our current x-ray inspection from manually inspection one panel per lot to 100% automated inspection for all of our BGA and CSP builds. We have 100% manual inspection at the end of our SMT lines and we are consideri
Electronics Forum | Tue Jul 09 10:15:17 EDT 2002 | msjohnston
Cal, Our parent company is a FAB and they are about to release a new generation of parts. Usually the die is qualified in a simple TSOP form factor. This time the first product quals will take place in the BGA and CSP from factors rather than the t
Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef
You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Mon Jun 26 12:23:11 EDT 2006 | Rob
Yep, Book a holiday and let someone else sort it out. Otherwise e-mail me and I'll talk you through pallets, rigidisers, printer tooling, spray mount, Kapton tape, local fiducials (panels can strech & shrink) etc. Oh, yeah - for the connectors you
Electronics Forum | Wed Mar 12 10:26:10 EDT 2008 | realchunks
Why would a board failure related problem be a process problem. I agree most companies believe EVERY problem is a Proces Problem, but in the real world we know this is not true. A pad lifting means your solder joint was able to rip it off the boa
Electronics Forum | Thu Apr 07 19:17:43 EDT 2022 | cbart
Good afternoon The ISI I was mentioning is interconnections solutions which is a division of Molex. a few years back we ran into a component end of life situation but had thousands of very high dollar bare boards in stock. the package was a BGA and w
Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
