Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh
Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
Electronics Forum | Mon Oct 18 11:34:19 EDT 1999 | Dave F
try: Anyone know a independent PCB inspection of BGA (X-Ray). - Rob C 09:37:20 06/08/1999
Electronics Forum | Thu Jan 28 10:28:59 EST 2010 | blnorman
2D with tilt will work. We have found opens on BGA balls with a 2D system tilted at the right angle.
Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef
RoHS Substance||RoHS MCV Limits||Typical Testing Approaches Lead||1000 ppm* ||Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy ||||XRF (X-ray fluorescence) spectroscopy Cadmium||100 ppm ||Wet
Electronics Forum | Wed Sep 05 10:55:15 EDT 2001 | caldon
ACI in Philadelphia can do this inspection. contact Barry Bloom at 610-362-1200 x 222. We can quote it per board, lot, component, time. what ever fits your need. Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org
Electronics Forum | Tue Jan 26 10:29:22 EST 2010 | devgru
You may want to contact YESTech (www.yestechinc.com) and see if they can help you out. If you are in the market to purchase, they have great systems. If you just need to look at a couple samples, they are pretty good about helping people out.
Electronics Forum | Tue Jan 26 12:29:09 EST 2010 | blnorman
A few years ago we sent some samples to Dage for them to analyze on one of their 3D systems.
Electronics Forum | Tue Jan 26 18:23:33 EST 2010 | glennster
I agree that Dage makes some excellent 3D (CAT) systems, but in our experience a high-resolution 2D system with tilt capability is usually better-suited for inspection of solder joints. Glenn Robertson Process Sciences
Electronics Forum | Fri Mar 26 19:32:05 EST 1999 | Martin Dunning
I am a student doing a project on rework os BGAS and CSPS and Im looking for information on it especially rework of csps Has anyone got x-ray images of csps after rework or of BGAS to show csps with solder balls Appreciate any help Urgent!!!!
