Electronics Forum | Sat Jan 14 06:38:04 EST 2006 | DannyJ
Hi Ken, Good question, and I did search for what you are asking, but unable to find anything conclusive about using tacky flux vs. solder. In reliability, it depends on which section of the process you are talking about. Mainly (and there are sev
Electronics Forum | Sun May 30 11:43:23 EDT 1999 | M Cox
| | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to
Electronics Forum | Thu Jul 23 11:39:16 EDT 1998 | Russ Miculich
Are you using a HASL board or an organic protection on the pads? This will help determine as to whether paste is necessary or just a very active/tacky flux should be used. Tight process control will also help in the reflow oven. Many users don't wan
Electronics Forum | Tue Jul 24 14:00:08 EDT 2001 | Steve Schrader
Greg, Yes, I did my tour of duty. Is your boss back from Bermuda yet? If so, tell her to check her email! Thanks. BTW, there could be a benefit to moving parts, but that would be dictated by your ability/inability to achieve a proper reflow prof
Electronics Forum | Wed Apr 28 15:08:10 EDT 2004 | russ
This could be a long shot but here goes. I have found that if flux is applied in excess that it will actually "move the solderballs" during reflow. I have actually seen where the balls are completely outside the package and oviously there are short
Electronics Forum | Sat Apr 26 20:27:18 EDT 2003 | LWEI
I'm working on a protobuild for a pcba. THis pcba uses double-reflow, paste-in-hole process. On bottom side there is a Ceramic BGA, size 35 X 35 mm, thickness 6mm, over 900 balls count (ball pitch 1mm)and it weighs a hefty 20 grams. Printing uses 6 m
Electronics Forum | Wed Jun 23 13:03:01 EDT 2004 | russ
I would ditto CAL, we have a jewel box 90 with the 5 axis and we love it. I really like being able to tilt,rotate,and move side to side front to back, Angle viewing under a BGA can be very informative as to the quality of reflow in seeing ball coll
Electronics Forum | Tue Nov 02 09:05:15 EST 2004 | russ
I have never experienced voids when using the flux only for application. Search the archives for void causes. As far as "more paste is better" I think that could be a true statement if we are talking about adapting to co-planarity type issues. My
Electronics Forum | Mon Jan 13 06:28:15 EST 2003 | johnw
Hi folk's, I'm looking for some help full suggestions here... I've got a ceramic BGA with tn/lead / bismuth balls on it that is over collapsing due to the weight of the momponnet vs the ablity of theball to suppot them. We've spok eto the component
Electronics Forum | Mon Feb 21 03:35:38 EST 2005 | abhirami
Thanks Grant and Dave. I have done extensive work on this and found some of the solder balls and solder flux does match my requirements. We have done many tests and have a good responses for both ceramic and plastic substrates. All is fine as long a
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