Electronics Forum | Thu Feb 25 14:06:56 EST 2010 | CL
Good Afternoon Duane, Surface tension should be adequate to hold the smaller BGA's during second side reflow. You will need to ensure that nothing comes in contact with the parts during reflow. I have added a chipbonder adheasive at the edge of some
Electronics Forum | Tue Oct 05 14:38:06 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Thu Apr 03 09:48:31 EST 2003 | davef
R1: Contacting Altera to find out if the BGA pads are gold. D1: Bet money the pads were ENIG. R2: Contacting Altera to find out if they use abrasives. D2: If abrasives were the problem, you�d see it in many pads, especially those close to the probl
Electronics Forum | Thu Nov 05 15:21:42 EST 1998 | Rich Breault
| Does anyone know of a company that reballs BGA's? Im looking for a reliable source that can do a 10/90 alloy. Hello Kenny, NETCO Automation has been performing all types of BGA rework including BGA reballing for the last 5 years. We offer 48 hour
Electronics Forum | Thu Nov 05 13:38:43 EST 2009 | davef
Martin It might be possible to mount a deballed BGA as you mount a QFN. Thinking about doing it, it could be a lot more difficult than first thought. When you heat a BGA, it 'dances' on the board because of the different CTE of the materials involved
Electronics Forum | Thu Jun 09 13:30:34 EDT 2005 | PWH
I would suggest 7mm thick "Durostone" as a carrier material. Cut lip/pocket for PCB so it is 0.05" thinner than thickness of PCB. Allow 0.010" gap on all sides of PCB. Machine lip to width between 0.050" and 0.100" to support under perimeter sides
Electronics Forum | Tue May 26 13:01:40 EDT 1998 | Earl Moon
| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint st
Electronics Forum | Wed Nov 15 16:14:02 EST 2000 | Scott Welle
We are having non-wet (head in pillow) problems with Altera 484's similar to the problems discussed on 10/27 timeframe. Need contacts to those people having similar problems. Will those who had problems with Motorola 357 (ref Chris and Glenn on 10/
Electronics Forum | Fri Apr 14 20:43:12 EDT 2000 | Mario J. Gislao
Mr. Mohan, I would suggest contacting OK International's Applications Engineering department directly. They are a world-recognized leader in providing BGA/CSP rework solutions and have one of the best rework machines on the market. Try contacting
Electronics Forum | Tue Jul 01 16:01:17 EDT 2003 | caldon
REX- Contact ACI 610-362-1200 x224. The contact person is Mr. Jeff Stong. They are cheap and will give you a report. www.aciusa.org jstong@aciusa.org There are some other labs that do this...but we use this one as it is close to us and they do a des
