Electronics Forum | Fri Mar 26 15:36:50 EDT 2010 | krish_bala
Hello Graham, We are currently using Tacky Gel Flux during our replacement process. We dip the BGA component on the flux prior to placement. Once it is dipped, the alignment and placement is done. As for the profile, I believe I am hitting the corr
Electronics Forum | Thu May 13 12:41:10 EDT 1999 | Eric
| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | I have been doing
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Electronics Forum | Sun Jan 09 19:37:15 EST 2005 | Bob R.
I'm just thinking out loud here with no experience to back it up, but I could see where you're trapping air or solvent filled voids inside the via by tenting from both sides. When you go through a heat cycle like reflow or wave solder you could be e
Electronics Forum | Tue Apr 25 16:42:00 EDT 2006 | russ
Sometimes you gotta do what you gotta do! We have to perform this on occasion as well. We perform this when we cannot get a board to stay free of tacoing, oilcanning, sagging or warping. (we needed a bigger preheater dimension wise) We have one no
Electronics Forum | Thu Jul 17 20:20:21 EDT 2014 | mac5
Hi June, The biggest issue with an OSP finish is as soon as the PCB sees a heat cycle (reflow or wave) the finish will begin to degrade. If you have a single sided SMT assembly with THT components installed downstream it works pretty good. But a dou
Electronics Forum | Mon Oct 15 08:15:41 EDT 2012 | scottp
Is the designer's concern that the parts will fall off when hanging upside down during reflow? We've been doing this for decades and our test if we think a part is marginal is to glue a 2nd (and sometimes 3rd) part to the back and send it through re
Electronics Forum | Mon Sep 17 09:47:18 EDT 2012 | mbnetto
Hi, Do you want to replace the SB ou just reflow it again? Do you suspect there is some "colder solder joint" in one of the SB balls ? In my opinion you are heating the board a lot... Did you put some thermocouple on the ball to check the temperat
Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Sat Nov 14 11:26:50 EST 1998 | Scott McKee
| | Any info on a BGA rework machine in the 10-20K range. | | | | Thanks | | Mike C | | | In the $60K range I really like the Pace model? (y'all join in). Whether there is a cheaper, non-programmable type, the gang can answer. | | Earl Moon | I p
