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Electronics Forum | Sat Aug 27 09:47:05 EDT 2005 | davef
From the pic, we see blistering, but none so close to via that we'd attribute the blistering to via, via plugging, or anything of the sort. When we see blisters like this, we think of a surface contaminant being present on the boards at the time of
Electronics Forum | Tue Aug 23 03:42:10 EDT 2005 | Adeline
presently, the production facing this problem. We has couple of brd which is electroylic gold finishing with plug via. The brd has blister after the PCBA (in lead free temperature, 265 degree) Some time, bare brd already has the blisters. But most of
Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko
My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how
Electronics Forum | Wed Aug 24 08:50:59 EDT 2005 | davef
First, while black pad can be a problem with poorly controlled electroless gold [search SMTnet Archives for background], it is not a suffiecient reason to use electrolytic. It's the reason the supplier should fix their electroless gold process. Se
Electronics Forum | Wed Aug 24 21:57:45 EDT 2005 | adeline_ko
The blistering is around the plugging via. I can forward you the pic. For the plugging process, I'm not too sure how they plug. What is the correct practise for the plugging via. Now, what they did is. They will do a tenting process for both side.
Electronics Forum | Tue Aug 23 13:10:29 EDT 2005 | davef
We've never heard of this [but all of our gold is electroless, not electrolytic]. If the delamination is caused by the electroylic gold finishing and the via plug process during fabrication, something is wrong. Either your supplier: * Is goofy ...
