Electronics Forum: board and msl (Page 6 of 89)

Water cleaning and Moisture Entrapment

Electronics Forum | Mon Jan 12 02:56:42 EST 2009 | sachu_70

Hi Bill, You should try pre-baking any such old devices prior to using on SMT Reflow. Refering to MSL-type3 guidelines could help in your case.

Mydata Pick and place

Electronics Forum | Tue Aug 28 09:53:44 EDT 2001 | Brock

Stefan, I could be wrong but I have a question about every 10th board having a defect. If a machine places 1 million components and a the board has 200 components you arrive at 5000 boards. If every 10th board has a defect, then only 500 boards have

MPM Up2000 and SMEMA

Electronics Forum | Tue Sep 13 07:00:28 EDT 2016 | awhite

Thanks for the reply. When you hit start on the printer, you can see it send the "start cycle (SMEMA)" signal, and it immediately goes to "awaiting board from upstream." This tells me that the printer knows a signal has definitely been sent and rece

Re: Paste-in_hole and CTE

Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan

Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e

Board Stacking and Conveying

Electronics Forum | Mon Mar 26 09:41:03 EDT 2018 | fuji_user_2014

Hi Gurus, Looking for alternatives to line makeup after reflow oven. Currently, I have a continuous on flat belt conveying out of my reflow oven straight to an EOL bench. The operator manually picks up the board off the belt (there is a roller at t

Blistering and delaminating boards

Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1

Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di

Touch-up and Inspection Process

Electronics Forum | Tue Mar 01 10:55:07 EST 2005 | spot

A lot depends on the complexity of the board/process as well as the amount of placements. If the board has few placements and the parts are not smaller that 0805 then doing all the rework after completion is ok. The human eye can only pick out obvi

Tooling and Fixtues

Electronics Forum | Thu Jul 22 17:39:58 EDT 2021 | proceng1

We do use a company for custom fixtures, but we also make some in house. The biggest hurdle for a board that requires a fixture to go through printing and SMT is that the board has to be the tallest thing. So any hold downs or locating hardware has

MPM Up2000 and SMEMA

Electronics Forum | Mon Sep 12 09:26:00 EDT 2016 | awhite

Our MPM Up2000 HIE is having a communication problem with any upstream machine we place in front of it...i.e. conveyor, board loader, etc. It all started when we removed a conveyor from inbetween it and a board loader, and hooked those machines up di

PCB Thickness and BLR

Electronics Forum | Mon Jun 03 13:26:32 EDT 2019 | az2019

Hi, I have a general question about the relationship of PCB thickness and BLR testing result. For example, I have QFN6x6 parts mounted on board in 1.2mm, 1.6mm, and 2.4mm thickness. All boards have 6 layers of Cu. Studies show thicker board gives les


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