Electronics Forum: board.after (Page 6 of 21)

PCB Baking after Wash

Electronics Forum | Tue Dec 02 18:10:39 EST 2008 | sys_steven

Need your opinion guys.. The old timers at the plant here feel that we should clean our board after Misprints withe the solvent cleaner over water wash. This is so they don't have to rebake the pcb for 24 hours before smt again. I don't believe th

layer 2 groundplane disconnects after hand solder

Electronics Forum | Fri Apr 10 13:25:08 EDT 2009 | jefflkupkt

Layer 2 is the ground plane layer of a 4 layer board. After installing a 2.5 mm DC power jack and 0.1 center SIP header by hand, the ground pin disconnects and causes an open. My board supplier said they passed Electrical Test. Prepreg was within

Inline wash foam

Electronics Forum | Thu Jun 28 09:40:49 EDT 2012 | austinpeterman

We just stepped into the inline wash world with a techical devices new clean galaxy plus. We are noticing a significant amount of foaming when washing our boards after selective solder. One theory is that the water soluble flux used is not being cu

Solder balls on pads - lead free

Electronics Forum | Mon Sep 17 05:48:10 EDT 2012 | stivais

Hi Ben, Yes, this could be the reason but have you ever seen solderability issues for (new) boards with LF-HAL surface finish? I have seen this only if there are surface finish quality issues for bare boards (exposed copper etc.). In this case we di

Can anyone tell me that between Mirtek & Kohyoung which AOI machine will be better and why?

Electronics Forum | Thu Feb 12 21:14:37 EST 2015 | kahrpr

They are both very good machines however Kohyoung will give you better first pass results meaning a lot less false calls and when you run the first board after initial programming you have to fix very few things. However the cost is a lot more. This

Shrinkage

Electronics Forum | Mon Sep 14 08:10:34 EDT 2015 | iamera

Hello Our production face a problem where our board after etching become shrinkage till 0.09mm but sometime it can be till 0.18mm. this happen after etching still the beginning of process not count for silver through hole and carbon process where th

Vapor degreasing cleaning

Electronics Forum | Tue Sep 01 16:47:25 EDT 2020 | charliedci

The problem that we have seen applying NC flux (EF2210) at selective solder is that the flux overspray (relative to the nozzle path) did not see high enough temperature to activate the flux and turn it to a non-conductive, benign residue as one would

microphoe low sensitivity

Electronics Forum | Mon Oct 12 17:28:39 EDT 2020 | rgduval

Check the microphone data sheet to find out what the max temperature is...if it's not listed, call the manufacturer. Are you water-washing the board after assembly? Could be water intrusion/entrapment in the microphone. Again, check the data she

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Wed Apr 28 06:26:15 EDT 2021 | jeremy_leaf

@Evtimov I can't use flux as the components being soldered can't cope with any contamination whatsoever. Even an ultra low solids no-clean flux will be too much. I also can't clean the boards after soldering due to any residual contamination from the

Lead free wave tools

Electronics Forum | Fri May 27 14:21:27 EDT 2005 | Frank

Back in the day, we had a small solder pot used for dipping ICs that were freshly removed from defective boards. What tool did we use to clean the dross? A small piece of card board. After the card board got too toasted, we'd grab a new piece of c


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