Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike
I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste
Electronics Forum | Tue Nov 11 16:01:09 EST 2003 | KSimpson
Adam, As for stripping the boards.. get them right to start with. Believe me you don't want to clean them. If you have to remove the coating most conformal coating brands offer a removal agent that has been tested on most all component ranges. IF yo
Electronics Forum | Fri Aug 28 23:32:39 EDT 1998 | Pete Sorenson
| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve I have used silver epoxy extensively for conductive bonding applic
Electronics Forum | Fri Jun 20 09:38:56 EDT 2003 | caldon
Hi John- First, I do not have first hand experience so my input is pure theory. This type of package (in Some Cases) has a center grounding bonds and leadless legs ups the difficulty tremendously. With no stand-off from the Balls(or Legs) when the so
Electronics Forum | Thu May 26 09:47:13 EDT 2005 | Dave G
We use the 3748. We picked it many moons ago after doing product HALT & HASS testing. Basically the run of the mill hotmelts didn't hold up as well under the conditions our equipment lives in. (We do a lot of MIL,Aero & Industrial motor/actuator driv
Electronics Forum | Fri Sep 02 09:02:10 EDT 2005 | dougs
you tell me, the customer has started to pull at some of the leads of some IC's with tweezers while de-bugging boards that had failed in the field, he was able to pull some of the leads away from the solder joints, we feel he may be over-doing it a
Electronics Forum | Wed Nov 28 17:02:28 EST 2007 | joeherz
We use TraCon's TraBond 2112 for staking applications where larger gaps are involved. It is formulated for PCB staking applications. The material is very low sag and high viscosity. It's 2part and comes in handy bi-paks. Work life is 20-30min.
Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit
Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower
Electronics Forum | Wed Feb 12 02:38:02 EST 2020 | majdi4
Hi there , I agree with phil .. but we cannot change the architecture of the card to mount the connector on the 2nd side. Steve , we are producing large series, so we can't manually ship bond the connector .. for the moment, we cannot invest in a gl
Electronics Forum | Wed Jul 26 10:06:19 EDT 2000 | Doug Philbrick
I have read many of the past threads on both topics and I still am not convinced I know the answer to the soldering problem we are encountering. I am hopping someone can help. I have a dense SMT board we are building and have been building for some
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