Electronics Forum | Wed Feb 21 14:40:44 EST 2001 | billschreiber
Hello Mark, As with any cleaning process, there are a number of variables that will affect the cleaning of adhesives with a Smart Sonic Stencil Cleaner: brand of adhesive, concentration of cleaning chemistry, temperature of wash solution, etc. Both
Electronics Forum | Fri Aug 03 14:55:26 EDT 2012 | davef
Not the best situation in the world, but you know that. Check with printer equipment suppliers [eg, DEK, MPM, etc] for a product called "Stencil Clean Wipes." Back in the old days, we'd: * Wipe the stencil with a solvent soaked wipe * Put the sten
Electronics Forum | Fri Oct 12 14:32:52 EDT 2001 | Mike Konrad
Hi, Maybe Yes� Maybe No� Actually, it most likely is acceptable to clean assembled boards in an ultrasonic cleaning system (40 kHz). There are some concerns in some circles about possible damage to wire bonds in components. There have been publi
Electronics Forum | Fri Apr 10 12:23:27 EDT 2015 | utosun
The recommended wash concentration for stencil cleaning with VIGON SC200 is 25% and this should be confirmed using the ZESTRON BA-20 bath analysis kit. Additional cleaning recommendations are: Wash temperature should be approximately 25 degrees C. /
Electronics Forum | Tue Sep 22 09:07:02 EDT 1998 | Steve Gregory
Hi Jacqueline! Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? If that is true, are there many vias concentrated aroun
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Fri Sep 28 02:48:46 EDT 2018 | teresat2
Principle A layer of photosensitive material (photosensitive oil or dry film) is applied to the copper foil on the board surface, and PCB manufacturer should be use the position is exposed by black film, This applies to most PCB factories, especially
Electronics Forum | Sat Nov 14 08:05:54 EST 1998 | Earl Moon
| | | | I believe that gold fingers on my circuit boards are being | | | | contaminated and need to clean them with some chemical | | | | solution. Any recommendations. | | | | | | | Chuck: What is the type and source of your contamination? Dave