Electronics Forum | Tue Dec 09 14:17:13 EST 2008 | dphilbrick
We exclusively use a printer to do glue these days but keep in mind there are times when glue and paste work best. Things like poor layout (ie shadowing) or tall parts that may shadow themselves or a wave solder machine that is not particularly good
Electronics Forum | Wed Dec 10 07:47:16 EST 2008 | benefon
If you find the correct type of adhesive/needle size then dispensing certainly is no problem. With a footed needle a very repeatable process too. Much more flexible than stencil printing and no need to mess around with stencil cleaning. But with auge
Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef
Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The
Electronics Forum | Wed Oct 27 11:32:57 EDT 1999 | Brian W.
When I evaluated a new glue type, I simply used a shear force tester (Chatillon) to compare the cured strengths of the different glues. I sampled parts of different types; 0805, SOT23, 1206, and various tantalum caps. I analyzed the data based on e
Electronics Forum | Fri Dec 12 12:01:44 EST 2008 | realchunks
As the technology has changed towards surface mount, so has the applying adhesive. In the past clinching parts would have knocked off SMD parts, but no that has all changed. So applying the adhesive via screen print is common and any thru-hole part
Electronics Forum | Fri Dec 19 10:18:05 EST 2008 | dyoungquist
On TH parts we have been hand soldering. This last summer we purchased a Rhythm selective solder machine from RPS automation. I did a factory tour of both RPS and ACE since both facilities are about 1/2 mile from each other. In comparing the 2 c
Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Sun Oct 03 18:26:17 EDT 1999 | park
What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? How about curing bottom side first and reflowing top side later? What percentage of companies run reflow/cure/wave for
Electronics Forum | Thu Dec 11 04:25:06 EST 2008 | lconnor
I have previously experienced dispensing glue dots using a camalot system. This was used to dispense dots for a variety of components, as the SMT was applied post through hole and then wave soldered. No paste was used in the process. The other benefi
Electronics Forum | Thu Mar 15 18:27:40 EST 2001 | traviss
Like I said it was only a rumor I heard but intrigued me enough to play around with it one day. The lambda wave worked better than the chip wave did with makes me believe it was the surface tension of the solder not melting the already soldered parts
