Electronics Forum | Wed Jan 17 12:10:47 EST 2018 | guilherme_castro
I have the follwing problem in our proccess we have to many problem with via hole and trought plated holes like voids air bubbles . During the eletricial test process our machine is not detecting this problems , the voids and air bubbles How
Electronics Forum | Tue Mar 05 07:42:03 EST 2019 | charliedci
We've noticed that bare PCB from fab house use bubble wrap vacuum sealed, however most of the time at the corners of stack of PCB bubble wrap is broken. Can't get our PCB house to change. For moisture sensitive components in house after partial use
Electronics Forum | Wed Mar 15 11:34:28 EDT 2023 | proceng1
I'm sure this isn't the same situation, but we did have a selective solder machine with crazy dross and solder ball build up. Turns out the operator switched the low pressure nitrogen line used for solder level and the high pressure nitrogen line fo
Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon
Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to
Electronics Forum | Sun Jul 26 07:52:35 EDT 2020 | sync40
Hello to everyone, Have you ever experienced soldermask bubbles inmediately after printed the soldermask itself? (for screen printing method of LPISM). I am not talking here about blistering or any outgassing defects after exposing to high temperatu
Electronics Forum | Tue Dec 28 21:51:04 EST 2004 | KEN
When using a foam fluxer: 1. Bubble size is important. What stones are you using? Ever clean them? Too large a bubble will NOT help your situation. (I forget bubble size range....check with your fluxer mfgr.) 2. Thinner will help in capilary m
Electronics Forum | Tue Jan 24 19:00:15 EST 2006 | MikeF
Graham Naisbitt is definitely an expert on conformal coating, he has posted answers here for years. Check your material to see what the cure mechanism is. Most urethanes need moisture from the air to cure, the higher the relative humidity the faste
Electronics Forum | Fri Nov 17 19:28:36 EST 2006 | rob@spinpcb.com
What kind of board finish do you have? You describe solder bubbles...and when you remove them, you find open vias. Are you, by chance, discovering flux contained in these bubbles? We've been experiencing the same thing with pb-free soldering on a
Electronics Forum | Thu Jan 31 15:13:20 EST 2008 | chef
You will need to develop your reflow profile which includes drilling a hole through the fab and into the ball for accurate temp measure. During profile/process development you will probably want 3D x-ray (consider contracting that out). Once in prod
Electronics Forum | Tue May 23 15:01:24 EDT 2000 | A. Marques
Hello, I think the problem can be: 1.�- some humidity in the adhesive, 2.�- some bubble of air in the adhesive when you cured the adhesive some humidity will go evaporate and when you make the soldering the same soldering will make a bridge between t
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