Electronics Forum | Sat Jan 14 06:38:04 EST 2006 | DannyJ
Hi Ken, Good question, and I did search for what you are asking, but unable to find anything conclusive about using tacky flux vs. solder. In reliability, it depends on which section of the process you are talking about. Mainly (and there are sev
Electronics Forum | Thu Apr 22 14:31:39 EDT 1999 | Dave F
Michael: Two things: 1. Profile: A. Your FR4 profile will not produce good solder connections on your ceramic substrate. Hey wait a minute, you soldered FR4 at 250C?? Ceramic is a themal sponge. You'll need to play, but it should be easy compare
Electronics Forum | Mon Apr 01 23:16:44 EST 2002 | dwoon
Hi, Heard about flux encapsulant - a compression-flow flux and underfill product for flip chip assembly. It eliminates the need for a separate underfill operation. Does anyone has experience in actual production run? What is the possible effect for
Electronics Forum | Tue Mar 31 08:11:51 EDT 2009 | davef
Solder ball formation can be a significant problem if the balls get trapped in the smaller spaces between ceramic chip carriers and substrates or possibly between the leads of small pitch leaded ICs. The solder balls also reduce the solder volume ava
Electronics Forum | Sat Oct 09 09:50:04 EDT 1999 | Ken Fong
Hi, We are using mixed technology in our PCBA. Would like to know whether there is any criteria governing/guiding the use of mixed technology in such aspects as: 1. Some SMDs cannot be used in some kind of PCB materials such as FR1? 2. Some SMDs are
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Wed Feb 25 08:30:44 EST 1998 | Earl Moon
| Happy Holidays All, | I am searching out a vendor (US preferred) who can fabricate a ceramic PCb with etremely fine lines. | Please reply if you are a vendor, or know of one. | Thanks, | Wendy CERAMIC CIRCUITRY Starting with hybrid thick film circ
Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F
Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed
Electronics Forum | Wed Feb 25 08:34:00 EST 1998 | Earl Moon
CERAMIC CIRCUITRY Starting with hybrid thick film circuits in 1965 at Sperry Flight Systems, I have been involved with ceramics (usually aluminum oxide) as the substrate material. Then, we developed "multilayer" circuitry (replacing "cordwood" module
Electronics Forum | Mon Oct 11 13:44:29 EDT 1999 | Dave F
Ken: Since Earl is no longer here, I guess I'll bite on this. Your questions are very broad and difficult to answer specifically. So, I'll give you broad and non-specific answers. | Hi, | | We are using mixed technology in our PCBA. Would like to