Electronics Forum: classification (Page 6 of 11)

Rework using flux pens

Electronics Forum | Tue Jan 08 17:29:20 EST 2002 | davef

Your research is on track. NC flux needs to reach activation temperature. Also, do not depend on the corrosion characteristics associated with the flux classification (ie, L1, L0, M1, M0, etc.), until the flux is activated by exposure to soldering

If we could bake the Board with OSP finish?

Electronics Forum | Thu Aug 05 16:15:18 EDT 2004 | pjc

Are you considering baking due to moisture exposure? Not all OSPs are created equal. I would check with your PWB fabricator about dry times and effects on their OSP finish. After you get it, I'd still try just one PWB for bake-dry out and check solde

Component Package/Classification

Electronics Forum | Mon Apr 18 20:13:27 EDT 2005 | Frank

Have you seen this mix up as well? 01005-inch (some people are simply saying 1005) components in metric are 0402-mm. And since 0402-inch is 1005-mm, it is a never ending circle of conversion confusions. We are using millimeters on the machines, bu

Component Package/Classification

Electronics Forum | Tue Apr 19 09:06:51 EDT 2005 | russ

1005 breaks down like this in mm. the "10" equals 1.0 mm, the "05" equals 0.5mm so, 1005. in inch conversion 1.0mm = .04", 0.5mm = .02" so 0402 (.04" x.02" = 1.0 x 0.5). Hope this helped.

Component Package/Classification

Electronics Forum | Fri Apr 22 00:57:56 EDT 2005 | Frank

If you are looking for a chart of component conversions, you can go to Topline Components's website. Topline is a vendor for dummy test parts. http://www.topline.tv/Products.cfm Click on the chips, and then select the type of chips (resistor, cap,

waste pb free

Electronics Forum | Thu Jan 05 17:35:36 EST 2006 | russ

"And don't look for logic or consistancy in polital matters". No kidding? I am having a hard time trying to figure out how you go about determining your levels of waste and also where to find "hazardous material" classifications for my area. I am

Baking planars after new BGA placed.

Electronics Forum | Mon Aug 14 20:37:03 EDT 2006 | davef

JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices *

solder paste for 200 degs c continuous operation?

Electronics Forum | Wed Mar 21 13:47:16 EDT 2012 | jax

To have an Operating Temp (Tool Classification) within your range, you might want to try. PB85 (Pb85/Sb10/Sn5) SMT is normally processed using Vapor Phase but can also be achieved with Nitrogen assisted Convection Reflow depending on size and compl

CM SIC code

Electronics Forum | Wed May 07 21:16:02 EDT 2008 | davef

Standard Industrial Classification (SIC) Code are sorta pass�. In 1997, the US Census Bureau replaced SIC with NAICS (North American Industry Classification System) in the US. See http://www.census.gov/epcd/www/naics.html NAICS code 334418 Printed

solder balls

Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord

Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t


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