Electronics Forum | Sun Oct 30 03:55:43 EST 2005 | mika
I apologize for my poor english. First: "Double sided sticky tape" is excellent for various reasons; right/left?. Second: NPI? Don't hesitate, If You feel that a certain machine in Your line cofiguration don't place certain/certain's components on th
Electronics Forum | Tue Jan 15 15:53:14 EST 2008 | jmelson
I only build my own products, so it has to meet my needs for QA only. I am doing some 20 mil lead pitch (0.5mm) and will soon be doing a 0.4 mm pitch part. I have more magnification on my microscopes (40X) but almost never need to go that high. If
Electronics Forum | Fri Jun 15 11:05:17 EDT 2007 | grantp
Hi, This is a little embarrassing asking this question, as I think I am profiling our oven incorrectly. I have been using the profile based on the solder paste specification, however we have been getting a large BGA chip coming more unreliable, and
Electronics Forum | Tue Jul 25 16:08:52 EDT 2017 | dontfeedphils
I'm currently working on bringing a manual coating process/workcenter online and my QA team is giving me some grief. For background, we're using Humiseal 1B31 thinned with thinner 521, mixed at 1:1 by volume. Spraying through a Binks HVLP with 10 P
Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef
We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Thu Nov 25 21:43:49 EST 1999 | cklau
Via is normally a plated thru holes in (0.63 to 1.0 mm (0.025" to 0.040") diameter lands , which unless properly treated they must be located away from the component lands to prevent the solder migration off the component land during reflow soldering
Electronics Forum | Fri Jul 23 14:07:52 EDT 1999 | Carl J. Odle
We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after a p
Electronics Forum | Mon Feb 15 17:57:01 EST 1999 | Earl Moon
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
