Electronics Forum | Thu Apr 12 13:23:18 EDT 2007 | slthomas
On the contrary, IPC-610 refers to flat ribbon leads in the same context as gullwing and "L" leads. I've always assumed that they were one in the same (could be wrong here...certainly wouldn't be anything new) and have never seen L or flat ribbon r
Electronics Forum | Mon Feb 18 09:38:30 EST 2002 | davef
Excuse me seeming to parrot Wolfgang�s posting, but he makes good points and I'd like to expand on them. I disagree that it's about disliking a "non-techie to post a reply/comment to the SMTNet forums." It's not about WHO posts. It's about WHAT i
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef
Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we
Electronics Forum | Mon Aug 13 09:49:35 EDT 2012 | rjlatz
I just got back from a visit to our PCBA manufacturer. We have good flowthrough on the PTH, but solder skips and bridges on the SMT SO IC's. We have correct orientation and robber pads, but the results are still the same. I noticed the wave shape is
Electronics Forum | Wed Jan 09 05:21:07 EST 2019 | jrogalski88
I will try this, thank you! Out of curiosity what about an 0807?? currently using an 1140 but there's still issues with that. I'm almost wondering if maybe parts just aren't sitting flat in the pocket so I'm getting pick and visioning issues.
Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139
Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Electronics Forum | Tue Apr 02 13:43:54 EDT 2013 | ericrr
On one of the products uses a QFP (Quad Flat Package)which is not going on straight, maybe 20 pins per 4 sides. sometimes I have to tweak the alignment before the board goes in the oven, this practice can be a bit of a worry if you over tweak it - pa
Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501
We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po
