Electronics Forum | Thu Feb 11 12:02:47 EST 2010 | plaiming
We have temporarily switched to an RTV for the vibration reincforcement, but it is not compatible with acrylic conformal coating and we really do not want to switch conformal coatings to a silicone based. Additionally we are testing the product in h
Electronics Forum | Wed Oct 29 06:17:45 EDT 2014 | julianf
As stated in the title I would like to know the thermo-elastic material properties, most preferably the E-modulus and CTE in x- and y-direction, for Epoxy/E-glass laminates and/or prepregs for various fibreglass cloth styles. Datasheets only give ro
Electronics Forum | Wed Oct 25 10:33:08 EDT 2000 | Chris
I need to know the advantages or disavantages of a plastic or FR4/Flex based BGA over the ceramic based BGA. We have a BGA package we are going to have produced. Some want to have it made out of ceramic because they feel a ceramic package will be a
Electronics Forum | Wed Oct 04 14:46:46 EDT 2000 | Kal. Chak.
Hi folks, What are the differences between Epoxy resin(ER)conformal coating and adhesive stacking/bonding material? My PSA/PRA (Post solder/reflow assembly)bracket assembly process got some ER adhesive encroachment on pads/solderjoints. I have chec
Electronics Forum | Thu Sep 07 15:24:29 EDT 2000 | Murad Kurwa
Steven, Try http://www.document-center.com/home. You will find various standards for BGAs freely-available but not for free. BTW, I have never seen a BGA underfilled. Only FC and CSPs. The standards available will explain when to.....High CTE delta
Electronics Forum | Mon Aug 21 20:20:18 EDT 2000 | Dave F
Hi CJ: I guarantee you that the portions of you BGA that will physically move the most as a result of changing temperature are the corners. For this very reason, many BGA have BT substrates that have a tg of 210�C. I would demonstrate the potentia
Electronics Forum | Wed Sep 01 14:31:22 EDT 1999 | Dave F
| To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has any
Electronics Forum | Thu Sep 10 11:57:20 EDT 1998 | James Michaud
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress reli
Electronics Forum | Fri Sep 11 00:52:19 EDT 1998 | Rick Thompson
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Thu Sep 10 10:07:46 EDT 1998 | J.H Kim
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE mismatches, no leads for stress relief,
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