Electronics Forum | Wed Oct 07 06:19:30 EDT 1998 | Charles Stringer
| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medi
Electronics Forum | Thu Oct 08 22:06:44 EDT 1998 | Eric R
| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medi
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Wed Nov 18 11:03:45 EST 1998 | Scott Lolmaugh
| | | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to
Electronics Forum | Mon Sep 21 21:21:32 EDT 1998 | Steve Gregory
| am working on the design of a showboard to demonstrate our | assembly capabilities. we are working with double sided assemblies involving BGAs and CSPs. could someone suggest | types of BGAs/ CSPs (type, name, I/O, etc)that would be a challenge t
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Fri Sep 21 16:00:55 EDT 2001 | davef
In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, �Design and Assembly Process Implementation for BGA's� Your boards should be assembled in conformance with: *
Electronics Forum | Sat Apr 28 08:04:29 EDT 2018 | shuhaib
Hi, please go through IPC 7093, its only for design and assembly process implementation for bottom termination components. its says up to 50% voids will not reduce ant electrical and thermal performance.
Electronics Forum | Fri Sep 08 22:48:48 EDT 2017 | ttheis
UL listing is handled by the customer typically. I am assuming you are a contract manufacturer producing only a component pcb assembly for use in a product final assembly and not the final product itself. We are a manufacturer that does our own popul
Electronics Forum | Fri Dec 22 14:38:34 EST 2006 | Mike Z
We are undertaking a project to try to put a rating system to our DFM documents for both PCB design, final assembly, and testing areas. I am wondering if anyone has found a tool that has been used as a DFM rating system so that I may save some time
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, USA
Phone: 5102268155
