Electronics Forum | Wed Jan 17 12:10:47 EST 2018 | guilherme_castro
I have the follwing problem in our proccess we have to many problem with via hole and trought plated holes like voids air bubbles . During the eletricial test process our machine is not detecting this problems , the voids and air bubbles How
Electronics Forum | Tue Nov 20 02:26:11 EST 2018 | bukas
hello everyone, I have this problem with one of my machines. it reports EMER error code: e804 "the scale of X axis can not be detected" has anyone encountered such error before? any idea what could cause it?
Electronics Forum | Fri Dec 22 16:28:07 EST 2023 | jeana
I've tried yesterday, I've spray painted a XF nozzle with mat black paint. (with some protection on the tip obviously). It is not really succesful though, Vision still have false detection. When a part is indeed on the tip, it detects it but with
Electronics Forum | Sun Dec 06 14:22:24 EST 2009 | Dany
We use Photondynamics SV-7550 now. We want to upgrade our AOI because we found that SV-7550 are not very good to detect solder defects. I send samples boards at each company with the solder defects that i can't detect with my Photondynamics SV-7550.
Electronics Forum | Mon May 07 09:47:45 EDT 2001 | orbotech
An ultimate truth in AOI is that "you can not avoid what you can not see". At the post solder stage, 2D inspection is typically not enough as it simply "can not see" everything using a single perspective, and therefore, can not detect all of the faul
Electronics Forum | Wed Jan 13 12:17:47 EST 2016 | trampacorp
Thanks for your input Michael. Basically the > boards had been go through from washing and even > ionic contamination already. In order to > eliminate or detect the flux residues, is there > any equipment something like a uv lamp that can > dete
Electronics Forum | Wed May 09 03:29:16 EDT 2001 | Eyal Duzy
Yes, your observation is accurate. Different process steps have different inspection requirements which necessitates employing different imaging technology to ensure the best performance (detection and throughput). Orbotech, for example, offers both
Electronics Forum | Wed Apr 30 08:00:33 EDT 2003 | pjc
Jason, In Transmission AXI the entire solder joint volume is imaged, not just a slice (no missing information) as with Cross-Section. Also, there is no signal loss from mechanical or digital image reconstruction (highest contrast and edge strength).
Electronics Forum | Sat Feb 14 15:47:07 EST 2004 | Larry
Depends a lot on what you want to solve. Very low volume conformation of componpents down to legends, process control or inspection of assembly. Biggest problem is they are resource hogs. Most require constant attention. Any change in component sup
Electronics Forum | Fri Feb 18 10:24:17 EST 2005 | Frank R.
We want to check for missing and misaligned component. The problem we have right now is concerning modifications. When ICT detect a problem ( missing component or a bad resistor value ) we have to remove soler, do the change and resolder. It's too
