Electronics Forum | Fri Apr 28 09:51:10 EDT 2000 | Erik
I'm looking for an adhesive to attach a metal can to the PCB to stop it from vibrating. The temperature spec is -50C(-58F) to 85C(62.8F). Thanks for the help Erik
Electronics Forum | Tue Jan 05 13:46:08 EST 1999 | Chrys
I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, Chrys
Electronics Forum | Wed May 07 11:31:21 EDT 2003 | cyber_wolf
Well Dave, Check the number that is on your adhesive tube. They make several different types of adhesives for use on different substrates. The rep from Dymax recommended the 3073 for bonding to FR4. We use a Dymax HHL400 handheld curing light. Click
Electronics Forum | Wed Aug 16 22:21:23 EDT 2000 | Dave F
Steve: Two things: 1 Chrys "The Thermo Princess" Shea wrote a great thread on attaching thermocouples that's in the SMTnet archives 2 Dymax (and probably others) makes a uV cureable thermal adhesive that's not a ugly to use as soldering thermal coup
Electronics Forum | Thu Nov 26 03:59:50 EST 1998 | Chi-Ting Chen
I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cause
Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon
| I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Tue Jan 12 15:02:12 EST 1999 | Earl Moon
| I have used conductive adhesives for some time now on thickfilm. Does anyone know of a really good conductive adhesive to attach flip chips to flex circuits? I would like to stencil print the adhesive to the substrate and then place the flips chi
