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Glass Wicking

Electronics Forum | Tue Nov 07 08:01:10 EST 2006 | davef

We/ve never heard of "glass wicking failure" in regards to board fab. Boat fab, yes. Look here: http://www.boatdesign.net/forums/showthread.php?t=13321 Barrel cracking appears after thermal stress during soldering, because epoxy expands in the "z"

Wave soldering profiling

Electronics Forum | Thu Jun 12 18:39:07 EDT 2003 | MikeF

Hexacon sells the LevChek, it is a special tempered glass plate for checking a wave solder machine. They make different sizes, so you can get one that is close to the maximum width of your wave. They also have grid lines etched on them so you watch i

IP3 X1 Encoder Alarm

Electronics Forum | Fri Feb 15 03:38:37 EST 2008 | keithej2

The X1 glass scale reader is bad. After cleaning it didn't help, we removed the read head and took the cover off. There is a cracked component (L1) and magic smoke/dust on the parts around L1. There's also a dead short on the two tiny wires that supp

Urethane Coating (1A33)

Electronics Forum | Wed Aug 27 08:06:43 EDT 2008 | davef

Thick, hard conformal coatings of acrylic, urethane and epoxy have a well documented history of causing solder joint cracks and breaking glass/ceramic and other brittle components. Dissimilar expansion and fairly high surface bond strengths of the ma

Quad 4C origin unstable

Electronics Forum | Mon Jul 22 04:59:01 EDT 2013 | bobpan

You have 1 of 2 problems. 1. The encoder is losing steps so it has a problem or the glass scale that it reads has something wrong with it....dirt,cracked,etc..... 2. The downward camera is loose or has a problem. With power on move the head to a posi

BGA attach eval.

Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef

You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai

Re: T sub G

Electronics Forum | Tue Aug 25 17:49:15 EDT 1998 | Earl Moon

| Hello, | Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal e

Wet or Dry Wipe

Electronics Forum | Fri Jan 06 10:49:03 EST 2006 | PWH

We had a bad situation with solvent wipe. One of the solvent supply lines cracked and the solvent got on a cluster of air lines. The air line material reacted poorly and we blew what seemed like one airline per day for a couple weeks. I had to cut

Re: BGA REFLOW PROBLEMS

Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F

Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm

Re: Cracked Capacitors

Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff

| | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from


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