Electronics Forum | Tue Apr 03 11:08:21 EDT 2001 | vsorin
Hi, Our engineering board has to decide which technology is better for the hand soldering of the SMT components: HASL or Chemical Ni-Au. We have an automatic line for SMD assembling and our experience shows us that for this automatic line is better
Electronics Forum | Mon Mar 07 10:59:17 EST 2011 | SheanDalton
RK, what are you trying to remove? What are you trying to remove it from? And, what type of equipment do you have? Generically, I suggest a saponifier, related to other aqueous chemistries, is associated with: -- higher PH -- need for effective che
Electronics Forum | Thu Mar 02 07:38:58 EST 2000 | Roni Haviv
Hello, I had experienced this kind of problem; Because the Au film is very thin (flash gold..) it is sometimes porositive and the Ni barrier below get Oxidation. After reflow there seems to be good solder fillets (visualy perfect!) but the leads wit
Electronics Forum | Sat Oct 28 02:11:56 EDT 2000 | hendri
dear sir/madame I am student sepuluh nopember institute technology of surabaya in indonesia country i have project that use cad/cam software for making pcb and i've got information that orcad,protel(os windows) and menthor graphic () can use
Electronics Forum | Thu Apr 27 04:41:48 EDT 2000 | Scott Davies
Our R&D people are looking at the possibility of "Silver Through Hole" as an alternative to "Plated Through Hole" for our future PCB specification. Do any of you have any experience of this, advantages/disadvantages, etc. I'm told that the main reaso
Electronics Forum | Wed Apr 26 11:50:18 EDT 2000 | Wolfgang Busko
Hi Sal, the way you do it has IMO some advantages: - no sophisticated support for the topside print - no extra thermal stress for the the bottomside bonding material - less possibilities to lose bottomside components by handling One disadvantage mig
Electronics Forum | Thu Mar 02 07:38:58 EST 2000 | Roni Haviv
Hello, I had experienced this kind of problem; Because the Au film is very thin (flash gold..) it is sometimes porositive and the Ni barrier below get Oxidation. After reflow there seems to be good solder fillets (visualy perfect!) but the leads wit
Electronics Forum | Thu Apr 05 02:54:34 EDT 2001 | GregH
Hi, We are planning to use RMA flux based Solder Paste for our line. We are currently using a No-Clean Solder Paste. Can I use an aqueous cleaner to clean my board with the above paste ? How will I clean the board ? What are the advantages and disad
Electronics Forum | Thu Apr 05 02:56:09 EDT 2001 | GregH
Hi, We are planning to use RMA flux based Solder Paste for our line. We are currently using a No-Clean Solder Paste. Can I use an aqueous cleaner to clean my board with the above paste ? How will I clean the board ? What are the advantages and disad
Electronics Forum | Thu Apr 05 02:56:11 EDT 2001 | GregH
Hi, We are planning to use RMA flux based Solder Paste for our line. We are currently using a No-Clean Solder Paste. Can I use an aqueous cleaner to clean my board with the above paste ? How will I clean the board ? What are the advantages and disad
