Electronics Forum | Thu Jul 15 22:03:07 EDT 2004 | KEN
In no particular order: Will the failed joints wet when touched with an iron + flux? Is there flux surrounding the joint (post reflow). If no, you may be baking it out premateurely. Is this assembly wave soldered? Where is defect discovered in yo
Electronics Forum | Fri Aug 06 21:43:40 EDT 2004 | KEN
In my wiper paper travels I discovered that many different brands are simply "repackaged" from a single manufacturer. Look at fiber size, weave and porosity. In one case two paper were identical, just dyed green. The prices ranged from 26 dollars
Electronics Forum | Thu Aug 26 21:54:57 EDT 2004 | KEN
I ran into this about 2 years ago. The Rework Operators (all 3 shifts) would rework a device, rince the board with tap water (yep, 50k / Cm^3) from a nearby sink, then send the PCB to test (which is really ironic as they had to walk past the DI wash
Electronics Forum | Thu Oct 21 13:31:41 EDT 2004 | LarryL
With the current failures of the Medium Power Linear Amplifier manufactured by RFMD (PN: RF2114), can anyone recommend a replacement part. The above part is used in a GPS transmitter, where I only have one recommended part on the part list. The manu
Electronics Forum | Mon Dec 13 16:25:37 EST 2004 | saragorcos
Hi Scott - No clean assemblies have a very low tolerance for processing residues, and long term reliability is compromised if residues from incoming bare boards, components, or un-solublized flux residues are not dealt with. It is critical to contro
Electronics Forum | Fri May 12 13:56:37 EDT 2006 | timnop
Steve, Thank you very much for your reply. What I really need to know now is how you discovered these issues. Did you run this product in your wave solder machine, and for how long? Are you now using SN100c instead? Please mention the other issues if
Electronics Forum | Mon Jun 05 11:51:40 EDT 2006 | jdumont
I was wondering if anyone could help point me in the right direction on this one. This morning I discovered that our hand solder operators have been using the liquid wave solder flux for some hand soldering operations. We are using Kester 245 63/37 n
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Fri Aug 04 13:33:15 EDT 2006 | Chunks
Hi Phil, It all depends on your product. You say small lot sizes, but are your board 20 by 20 inches in size with 5K parts both top and bottom? If so then even building 3 of these could take you days to build. Then take you weeks to trouble shoot
Electronics Forum | Fri Nov 03 15:31:18 EST 2006 | Steve
Mika, It's not my company, I've used them in the past to re-ball some BGA's for me. They always do a moisture removal bake on moisture sensitve devices prior to ball attach, and then pack them in a vacuum sealed moisture barrier bag when they retu
