Electronics Forum: dissipative (Page 6 of 16)

EPTSSOP

Electronics Forum | Thu Jul 19 21:55:14 EDT 2001 | davef

You're correct, but you need to take it a little bit further. Installed correctly, ExposedPad� TSSOP IC packages significantly increase the thermal efficiency of power constrained standard TSSOP packages. This can increase heat dissipation by as mu

solder mask onto pad or pad defined by solder mask?

Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef

We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have

High Temp Solder Application

Electronics Forum | Tue Nov 07 14:31:01 EST 2000 | John

My company manufactures a board for a heavy duty automotive application. One of the through hole parts on the board dissipates enough heat that it requires high temp solder. Does anyone know of or have experience with a high quality selective solde

Re: Adhesive Stencils

Electronics Forum | Tue Jul 11 10:28:02 EDT 2000 | John Thorup

Dave, George I think we're missing something here, or at least I am. While the plastic in question could possibly be dissipative or non generating, I'm wondering how thick such a stencil would be to clear even the lowest profile PTH component? Can w

Re: Back to back SMT Tantalum capacitors

Electronics Forum | Thu Dec 30 21:51:47 EST 1999 | Dave F

Jason, if you're considering: * "Stacking" components, it's a bad idea because you're reducing the surface area of the lower component, which is required for heat (power) dissipation. * Multiple components side-by-side or end-to-end, it acceptable

Flip chip or wire bond?

Electronics Forum | Fri Jan 03 16:14:37 EST 2003 | Jacques Coderre

Hi Jon, Flip Chip is chosen as an interconnect approach when one needs improved performance (high pin count, high frequency, noise reduction or improved heat dissipation.Another driver is size...Flip Chip greatly reduces the area and therefore is cho

P&P Machine & ESD Protection

Electronics Forum | Mon Jan 20 09:55:09 EST 2003 | Claude_Couture

The carrier tape and cover tape of static sensitive components are either conductive or dissipative. as for the P&P machine, as long as they are made of metal and grounded, static buildup is not an issue. All PCB conveyors I've seen have static condu

Wave Soldering Upflow

Electronics Forum | Tue Aug 05 17:19:55 EDT 2003 | csimfgeng

Another variable is whether the ground pads have proper thermal reliefs. If the pad has solid ground plane around the perimeter, the heat being applied will quickly dissipate to the surrounding metal. A proper relief of the pad will prevent the hea

Static control for shelving

Electronics Forum | Fri Aug 08 15:30:50 EDT 2003 | bman

Hello all, I'm working at a CM with less then ideal material storage shelving when it comes to ESD protection. I've got ordinary painted shelving units that I need make ESD safe. I'm considering dissipative mats or spray coatings for each shelf, t

Looking for Wave-Exit conveyor belt(ESD, heat dissipative, flux)

Electronics Forum | Tue Dec 16 16:14:20 EST 2003 | Bill

We are in need of a replacement conveyor belt for an unload-end conveyor(post wave solder). The part number we had at one point (formerly PCT automation) was 65-4008-4 (Belt, Flat-W=23.75 L=171.70) green high temp conveyor belt. Any help would be g


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