Electronics Forum | Tue Jul 24 17:15:13 EDT 2007 | blnorman
Unless you've got an extremely agressive cleaner, the epoxy should hold the parts during the delay time. That's their job basically. We ran reflow first pass, glue parts, then wave solder second pass. There were potential delays between adhesive b
Electronics Forum | Fri May 24 19:18:03 EDT 2013 | hegemon
The formula is a great help, where was it 20 years ago? LOL After running a few thousand different products over the years, you start to get a feel for what is going to be trouble with regards to falling off the bottomside during the secondary refl
Electronics Forum | Sun Oct 03 21:36:57 EDT 1999 | JAX
| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur
Electronics Forum | Thu Jun 20 08:31:36 EDT 2002 | davef
You can use a peelable, rather than a water washable, temporary solder mask? Points are: * Vinyl peelable is preferred over latex, because of lower residues. You should be very concerned about this since you are probably running a low residue proce
Electronics Forum | Tue Sep 22 11:20:08 EDT 1998 | S Maganti
We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along with
Electronics Forum | Thu Mar 01 11:47:20 EST 2007 | Wagoner
Run the lead free BGA side first. Then run the tin lead side second. We do this on some boards so that we don't overheat the components on the second side. There is no reason that the lead free solder needs to reflow on the second pass.
Electronics Forum | Thu Jun 20 03:29:56 EDT 2002 | Josef
I would like to ask you for help. We use mixed technology and we need to protect SMT components in double Wave. Currently we use the carrier for protection of this component. In this case this procces is not possible to use it due to gap between SMT
Electronics Forum | Thu Mar 01 12:08:33 EST 2007 | rob_thomas
It sounds like something is a little off here. ROHS compatible and ROHS capable parts are going to be ok with a leaded solder paste and processing unless you are building high reliability product.( some are going to argue that even high rel products
Electronics Forum | Tue Sep 22 13:14:27 EDT 1998 | Chrys
| We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along wit
Electronics Forum | Fri Mar 02 09:08:25 EST 2007 | samir
There is a formula that determines whether a component will fall off during a 2nd reflow. It takes into account the grams (weight) of the component and the total surface area of the solder joints. I don't know this off the top of my head, but it's
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