Electronics Forum: dry solder (Page 6 of 62)

Is baking PCB necessary before solder process?

Electronics Forum | Wed Jul 28 20:28:26 EDT 1999 | Carlos Palacios

Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into n

Micro Leadless Frame - solder wetting control

Electronics Forum | Wed May 08 23:48:01 EDT 2002 | ianchan

Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Fri Dec 18 09:27:51 EST 2009 | sforman1

Tom: Once again - why are you using solvent based conformal coating. 1B31 is OK as a CC but it contains Toluene and MEK!! It is only 35% solids which means you are trying to get rid of 65% solvent. If you must use it due to customers requirement then

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Mon Dec 28 09:12:56 EST 2009 | kpm135

@tommyg_fla According to the TDS the recommended coating thickness for Humiseal 1B31 is only 1-3 mils so if I had to guess I would say your issue might be that you're re-coating over the first pass too soon. All the solvent hasn't evaporated and the

Spray fluxing VOC free, as operation HOURS before wave solder

Electronics Forum | Wed Sep 20 10:36:27 EDT 2006 | proy

I am considering moving my spray fluxer into a completely separate operation. Has anybody any comments of sraying VOC free flux on boards, then putting them in a drier/holding rack for possibly say overnight, then running them through wave solder?

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Thu Sep 11 10:18:15 EDT 2008 | gregoryyork

Sorry all I know is that storing the paste Tip down the flux will run to the tip of the cartridge so will be runny initially then dry up as you use the cartridge. Unless the Rheopump mixes it before application

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Thu Sep 11 11:11:31 EDT 2008 | gregoryyork

Yes sorry you are right so you have answered your own question anyway. Dry to start runny at the end

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Wed Oct 04 14:18:05 EDT 2006 | C.K. the Flip

The main cause of voids is your flux out-gassing during reflow. Try a little "knee" or slight soak in your thermal profile to dry out the volatiles a bit. Typical soak ranges from 130 deg. C to 170 deg. C for around 30-90 seconds.

Warming up solder paste at start of days production

Electronics Forum | Mon Jul 26 19:37:47 EDT 2004 | Grant

Hi, It was funny. The sight of 3 men standing around the microwave daring each other to push the start button, and then freaking out when the whole thing looked as though it was going to explode was funny. I guess you have to try these things! Tho

Testing effect of non-clean flux residue on solder joints

Electronics Forum | Fri Nov 03 15:43:20 EDT 2017 | dleeper

IPA and DI water are both very common and effective methods of cleaning PCBAs. http://www.zestron.com/sa/cleaning-applications/smt-electronic-cleaning/pcba-cleaning/aqueous-cleaning.html http://blog.gotopac.com/2010/11/18/ipa-as-a-universal-cleaner


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