Electronics Forum: edge connector (Page 6 of 17)

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef

You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol

no clean flux + wave soldering issue

Electronics Forum | Wed Aug 27 14:58:21 EDT 2008 | omid_juve

we have problem in setting the density of a no clean flux for using before wave soldering . first we dilute the flux but we have many short circuit problem between the pads of edge connector,then we densify the flux all the short circuit is removed b

Need gold fingers (edge contacts) widened in eagle then saved to Gerber.

Electronics Forum | Fri Sep 01 15:52:03 EDT 2017 | wyluliwolf

Long story short: I paid someone to convert some older Gerber files to the new RS-274x format for me so I could have them manufactured. I sent them the original Gerber files (RS-274D) along with additional files showing information on the layout. T

SMT Edge Connectors

Electronics Forum | Fri Sep 15 16:30:13 EDT 2006 | russ

yes there is Caveman, (well maybe depending on your circumstances) you need to purchase a manual printer and print the connector then flip and print the other side. (you need a manual printer so you can print after the parts have nbeen reflowed, we

GSM / universal genesis programming components that hang over the edges of the PCB (connectors)

Electronics Forum | Wed Oct 26 22:39:01 EDT 2022 | sarason

This is not really a bug. The logic is this if you place a component beyond the edge of the board, it should falloff! So instead on having a very complex algorithm to work out component centres and then make a judgement as to whether the connector is

Wavesoldering

Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam

The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T

Step-up stencil: recommendation thickness

Electronics Forum | Mon May 20 16:15:48 EDT 2019 | davef

Resources are: * IPC-7525A - Stencil Design Guidelines, 3.5.2 Step-Up Stencil This type stencil is useful when it is desirable to print thicker solder paste in a small portion of the stencil. An example would be a ceramic BGA where it is necessary t

Low Height Wire to Board Connector

Electronics Forum | Fri Aug 07 13:29:53 EDT 2009 | cadone

Hi, We are designing a PCB where I need a Low height wire to board connector at the edge. I am looking for a 2 wire female surface mount connector that is not taller than 2.5mm Can any one here suggest me a place I can find this. Thanks CADone

Quad IVc power up

Electronics Forum | Mon Apr 13 14:36:18 EDT 2009 | leemeyer

I have seen this problem before. There is a cable that runs from the Quadalign board to the backside of the backplane. It is not secured in any way so it may have come loose in shipping. Open the right side panel on the machine. The Quadalign board

IMMERSION GOLD VS HARD GOLD PLATTING

Electronics Forum | Thu Jan 09 15:19:41 EST 2014 | davef

For a typical wear surface application [millions of wipes], I agree with hege. You need to be talking electrolytic gold, NOT immersion gold. IPC-2221 says something like ... For edge connectors and areas not to be soldered: * Nickel - 2.5um [~100uin]


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